CY7C1471V33_12 CYPRESS [Cypress Semiconductor], CY7C1471V33_12 Datasheet - Page 19

• Manufacturer Part Number: CY7C1471V33_12
• Manufacturer: CYPRESS [Cypress Semiconductor]

Document History Page
Document Number: 38-05288 Rev. *N
Document Title: CY7C1471V33, 72-Mbit (2 M × 36) Flow-Through SRAM with NoBL™ Architecture
Document Number: 38-05288
Rev.
*C
*D
*A
*B
*E
*F
**
223721
243572
320197
114675
121521
235012
299511
ECN
Orig. of
Change
RYQ
PKS
CJM
SYT
NJY
NJY
PCI
Submission
See ECN
See ECN
See ECN
See ECN
See ECN
08/06/02
02/07/03
Date
New data sheet.
Changed status from Advanced Information to Preliminary.
Updated
Updated
Updated
Updated
information).
Updated Logic Block Diagram (Splitted Logic Block Diagram into three Logic
Block Diagrams).
Updated
Updated
information).
Updated Boundary Scan Exit Order (Replaced TBD with values for all
packages).
Updated
information, replaced TBD with values for maximum values of I
I
Updated
Updated
Updated
information).
Updated
Updated
Updated
removed spec 51-85143 and included spec 51-85167 for 209-Ball BGA
package, removed spec 51-85115 (corresponding to 119-BGA package)).
Updated
(15 × 17 × 1.40 mm) pinout (3 Chip Enable with JTAG)” (Changed ball H2 from
V
(Changed ball R11 from DQPa to DQPe)).
Updated
parameters and also updated the values).
Updated
Updated
Updated
information).
Updated
24.63 C/W, changed value of 
TQFP package).
Updated
information).
Updated
frequency related information, added Pb-free information for 100-pin TQFP,
165-ball FBGA and 209-ball BGA Packages), added comment of “Pb-free BG
packages availability” below the Ordering Information).
Updated
of “Pb-free BG packages availability” below the Ordering Information).
Minor Change (To match on the spec system and external web).
SB3
DD
, I
to NC), updated Figure “209-ball BGA (14 × 22 × 1.76 mm) pinout”
SB4
Ordering Information
Package Diagrams
Features
Ordering Information
Features
Functional Description
Selection Guide
Functional Overview
Electrical Characteristics
Capacitance
Thermal Resistance
Switching Characteristics
Switching
Ordering Information
Pin Configurations
Capacitance
Features
Selection Guide
Electrical Characteristics
Thermal Resistance
Switching Characteristics
Ordering Information
parameters).
(for package offering).
(Removed 150 MHz frequency related information).
(Removed 117 MHz frequency related information).
Waveforms.
(Replaced TBD with values for all packages).
(Splitted C
(Removed 150 MHz frequency related information).
(Removed 117 MHz frequency related information).
Description of Change
(Updated Figure “165-Ball FBGA
(spec 51-85165 (Changed revision from ** to *A),
(Replaced TBD with values for all packages).
(Changed value of 
(No change in part numbers, removed comment
(Removed 150 MHz frequency related
(Updated part numbers).
(Updated part numbers).
(Updated part numbers (Removed 117 MHz
(Removed 150 MHz frequency related
JC
IN
(Removed 150 MHz frequency related
(Removed 117 MHz frequency related
from 3.3 C/W to 2.28 C/W for 100-pin
(Removed 150 MHz frequency related
(Removed 117 MHz frequency related
parameter into C
JA
ADDRESS
from 16.8 C/W to
CY7C1471V33
, C
DD
DATA
Page 19 of 22
, I
SB1
, C
, I
CLK
SB2
,