S29CD-J_12 SPANSION [SPANSION], S29CD-J_12 Datasheet - Page 8

• Manufacturer Part Number: S29CD-J_12
• Manufacturer: SPANSION [SPANSION]

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8
Ordering Information
The order number (Valid Combination) is formed by the following:
S29CD032J
S29CL032J
Device Number/Description
S29CD032J/S29CD016J (2.5 volt-only), S29CL032J/S29CL016J (3.3 volt-only)
32 or 16 Megabit (1M or 512k x 32-Bit) CMOS Burst Mode, Dual Boot, Simultaneous Read/Write Flash Memory
Manufactured on 110 nm floating gate technology
0
J
F
A
S29CD-J and S29CL-J Flash Family
I
0
0
0
D a t a
Packing Type
0
2
3
Boot Sector Option (16th Character)
0
1
2
3
Autoselect ID Option (15th Character)
0
1
0
0
0
Temperature Range
I
M
Material Set
A
F
Package Type
Q
F
B
Clock Frequency (11th Character)
J
M
P
R
Initial Burst Access Delay (10th Character)
0
1
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
S h e e t
Tray, FBGA: 180 per tray, min. 10 trays per box
Tray, PQFP: 66 per tray, min. 10 trays per box
7” Tape and Reel, FBGA: 400 per reel
13” Tape and Reel, FBGA: 1600 per reel
13” Tape and Reel, PQFP: 500 per reel
Top Boot with Simultaneous Operation
Bottom Boot with Simultaneous Operation
Top Boot without Simultaneous Operation
Bottom Boot without Simultaneous Operation
7E, 08, 01/00 Autoselect ID
7E, 36, 01/00 Autoselect ID
7E, 46, 01/00 Autoselect ID
7E, 09, 01/00 Autoselect ID
7E, 49, 01/00 Autoselect ID
Industrial (–40°C to +85°C)
Extended (–40°C to +125°C)
Standard
Pb-free Option
Plastic Quad Flat Package (PQFP)
Fortified Ball Grid Array, 1.0 mm pitch package, 13 x 11 mm package
40 MHz
56 MHz
66 MHz
75 MHz
5-1-1-1, 6-1-1-1, and above
4-1-1-1 (40 MHz only)
Fortified Ball Grid Array, 1.0 mm pitch package, 11 x 9 mm package
S29CD-J_CL-J_00_B7 October 11, 2012
S29CD016J only
S29CL016J only
S29CD032J only
S29CL032J only