S29CD-J_12 SPANSION [SPANSION], S29CD-J_12 Datasheet - Page 17

• Manufacturer Part Number: S29CD-J_12
• Manufacturer: SPANSION [SPANSION]

5.6
October 11, 2012 S29CD-J_CL-J_00_B7
LAD080–80-ball Fortified Ball Grid Array (11 x 9 mm) Physical Dimensions
PACKAGE
JEDEC
SYMBOL
SD / SE
D X E
MD
ME
A1
D1
E1
eE
eD
A
D
E
N
b
0.35
0.55
MIN
---
11.00 mm x 9.00 mm
PACKAGE
11.00 BSC
9.00 BSC
9.00 BSC
7.00 BSC
1.00 BSC
1.00 BSC
0.50 BSC
LAD 080
NOM
0.45
0.65
N/A
N/A
---
10
80
8
MAX
1.40
0.55
0.75
PROFILE
BALL HEIGHT
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
D a t a
S29CD-J and S29CL-J Flash Family
NOTE
S h e e t
NOTES:
1. DIMENSIONING AND TOLERANCING METHODS PER
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JEP95, SECTION
4.
5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE
6
7
8. “+” INDICATES THE THEORETICAL CENTER OF DEPOPULATED BALLS.
9
ASME Y14.5M-1994.
4.3, SPP-010.
"D" DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
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