ADF4116 Analog Devices, ADF4116 Datasheet - Page 4

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ADF4116

Manufacturer Part Number
ADF4116
Description
Single, Integer-n 550 MHZ PLL
Manufacturer
Analog Devices
Datasheet

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ADF4116/ADF4117/ADF4118
ABSOLUTE MAXIMUM RATINGS
(T
AV
AV
V
V
Digital I/O Voltage to GND . . . . . . . . –0.3 V to V
Analog I/O Voltage to GND . . . . . . . . . –0.3 V to V
REF
RF
Operating Temperature Range
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . 150°C
TSSOP θ
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumu-
late on the human body and test equipment and can discharge without detection. Although the
ADF4116/ADF4117/ADF4118 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions
are recommended to avoid performance degradation or loss of functionality.
Model
ADF4116BRU
ADF4117BRU
ADF4118BRU
Contact the factory for chip availability.
P
P
A
Industrial (B Version) . . . . . . . . . . . . . . . –40°C to +85°C
IN
DD
DD
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
to AV
= 25°C unless otherwise noted)
IN
A to RF
to GND
to DV
, RF
DD
JA
IN
Thermal Impedance . . . . . . . . . . . . . 150.4°C/W
DD
A, RF
CLOCK
IN
. . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +5.5 V
DATA
3
B . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 320 mV
LE
LE
. . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
. . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
IN
B to GND . . . . . . –0.3 V to V
DB20 (MSB)
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
1, 2
t
1
DB19
t
2
DD
DD
P
+ 0.3 V
+ 0.3 V
+ 0.3 V
ORDERING GUIDE
Package Description
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
DB2
t
3
CSP θ
Lead Temperature, Soldering
NOTES
1
2
3
TRANSISTOR COUNT
6425 (CMOS) and 303 (Bipolar).
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
This device is a high-performance RF integrated circuit with an ESD rating of
< 2 kV and it is ESD sensitive. Proper precautions should be taken for handling
and assembly.
GND = AGND = DGND = 0 V.
(Paddle Soldered) . . . . . . . . . . . . . . . . . . . . . . . . . 122°C/W
(Paddle Not Soldered) . . . . . . . . . . . . . . . . . . . . . . 216°C/W
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
t
4
(CONTROL BIT C2)
JA
Thermal Impedance
DB1
(CONTROL BIT C1)
DB0 (LSB)
WARNING!
t
5
t
6
Package Option
RU-16
RU-16
RU-16
ESD SENSITIVE DEVICE

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