sfi9640 Fairchild Semiconductor, sfi9640 Datasheet

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sfi9640

Manufacturer Part Number
sfi9640
Description
Advanced Power Mosfet
Manufacturer
Fairchild Semiconductor
Datasheet
©1999 Fairchild Semiconductor Corporation
Advanced Power MOSFET
Thermal Resistance
FEATURES
Absolute Maximum Ratings
*
T
When mounted on the minimum pad size recommended (PCB Mount).
Symbol
Symbol
Avalanche Rugged Technology
Rugged Gate Oxide Technology
Lower Input Capacitance
Improved Gate Charge
Extended Safe Operating Area
Lower Leakage Current : 10 A (Max.) @ V
Low R
J
dv/dt
R
R
R
V
V
E
E
I
I
P
, T
I
T
DM
DSS
AR
D
GS
AS
AR
JC
JA
JA
D
L
STG
DS(ON)
Drain-to-Source Voltage
Continuous Drain Current (T
Continuous Drain Current (T
Drain Current-Pulsed
Gate-to-Source Voltage
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Total Power Dissipation (T
Total Power Dissipation (T
Linear Derating Factor
Operating Junction and
Storage Temperature Range
Maximum Lead Temp. for Soldering
Purposes, 1/8 “ from case for 5-seconds
: 0.344
(Typ.)
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
Characteristic
Characteristic
A
C
=25
=25
C
C
=25
=100
*
o
o
C)
C)
DS
o
C)
o
= -200V
C)
*
O
O
O
O
O
1
2
1
1
3
Typ.
--
--
--
- 55 to +150
-200
Value
12.3
0.98
-7.0
-5.0
807
123
300
-11
-44
+ _
-11
1
3.1
BV
R
I
3
1. Gate 2. Drain 3. Source
SFW/I9640
D
D
30
DS(on)
2
-PAK
DSS
= -11 A
Max.
1.02
62.5
40
= 0.5
= -200 V
2
1
2
3
I
2
-PAK
Units
Units
o
W/
V/ns
C/W
mJ
mJ
o
W
W
V
A
A
V
A
C
o
C
Rev. B

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