MK30DN512ZVLQ10 Freescale Semiconductor, MK30DN512ZVLQ10 Datasheet - Page 31

• Manufacturer Part Number: MK30DN512ZVLQ10
• Description: Specifications: Program Memory Size: 512KB (512K x 8) ; RAM Size: 128K x 8 ; Number of I /O: 102 ; Package / Case: 144-LQFP ; Speed: 100MHz ; Oscillator Type: Internal ; Packaging: Tray ; Program Memory Type: FLASH ; EEPROM Size: - ; Core Processor:
• Manufacturer: Freescale Semiconductor

6.3.3.2 32kHz oscillator frequency specifications
1. Proper PC board layout procedures must be followed to achieve specifications.
6.4 Memories and memory interfaces
6.4.1 Flash (FTFL) electrical specifications
This section describes the electrical characteristics of the FTFL module.
6.4.1.1 Flash timing specifications — program and erase
The following specifications represent the amount of time the internal charge pumps are
active and do not include command overhead.
1. Maximum time based on expectations at cycling end-of-life.
6.4.1.2 Flash timing specifications — commands
Freescale Semiconductor, Inc.
t
hversblk256k
t
Symbol
Symbol
Symbol
rd1blk256k
t
t
t
t
rd1sec2k
hversscr
f
hvpgm4
pgmchk
t
t
osc_lo
t
rdrsrc
pgm4
start
Oscillator crystal
Crystal start-up time
Longword Program high-voltage time
Sector Erase high-voltage time
Erase Block high-voltage time for 256 KB
Read 1s Block execution time
Read 1s Section execution time (flash sector)
Program Check execution time
Read Resource execution time
Program Longword execution time
Description
Description
Description
• 256 KB program/data flash
Table 20. NVM program/erase timing specifications
Table 19. 32kHz oscillator frequency specifications
Table 21. Flash command timing specifications
K30 Sub-Family Data Sheet Data Sheet, Rev. 6, 9/2011.
Table continues on the next page...
Min.
Min.
Min.
—
—
—
—
—
—
—
—
—
—
Peripheral operating requirements and behaviors
32.768
1000
Typ.
Typ.
Typ.
416
7.5
13
65
—
—
—
—
3616
Max.
Max.
Max.
113
145
1.7
18
60
45
30
—
—
Unit
kHz
Unit
Unit
ms
ms
ms
ms
μs
μs
μs
μs
μs
Notes
Notes
Notes
1
1
1
1
1
1
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