MK30DN512ZVLQ10 Freescale Semiconductor, MK30DN512ZVLQ10 Datasheet - Page 19

• Manufacturer Part Number: MK30DN512ZVLQ10
• Description: Specifications: Program Memory Size: 512KB (512K x 8) ; RAM Size: 128K x 8 ; Number of I /O: 102 ; Package / Case: 144-LQFP ; Speed: 100MHz ; Oscillator Type: Internal ; Packaging: Tray ; Program Memory Type: FLASH ; EEPROM Size: - ; Core Processor:
• Manufacturer: Freescale Semiconductor

2. V
3. Specified according to Annex D of IEC Standard 61967-2, Measurement of Radiated Emissions—TEM Cell and Wideband
5.2.7 Designing with radiated emissions in mind
To find application notes that provide guidance on designing your system to minimize
interference from radiated emissions:
5.2.8 Capacitance attributes
5.3 Switching specifications
5.3.1 Device clock specifications
5.3.2 General switching specifications
These general purpose specifications apply to all signals configured for GPIO, UART,
CAN, CMT, and I
Freescale Semiconductor, Inc.
1. Go to http://www.freescale.com.
2. Perform a keyword search for “EMC design.”
TEM Cell Method
FB_CLK
Symbol
Symbol
f
C
C
f
DD
LPTMR
FLASH
f
f
IN_A
IN_D
SYS
BUS
= 3.3 V, T
Input capacitance: analog pins
Input capacitance: digital pins
Description
System and core clock
Bus clock
FlexBus clock
Flash clock
LPTMR clock
Description
A
= 25 °C, f
2
C signals.
OSC
K30 Sub-Family Data Sheet Data Sheet, Rev. 6, 9/2011.
= 12 MHz (crystal), f
Table 9. Device clock specifications
Table 8. Capacitance attributes
SYS
Normal run mode
= 96 MHz, f
BUS
= 48 MHz
Min.
—
—
—
—
—
Min.
—
—
Max.
100
50
50
25
25
Max.
7
7
MHz
MHz
MHz
MHz
MHz
Unit
Unit
Notes
pF
pF
General
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