MK30DN512ZVLQ10 Freescale Semiconductor, MK30DN512ZVLQ10 Datasheet - Page 3

• Manufacturer Part Number: MK30DN512ZVLQ10
• Description: Specifications: Program Memory Size: 512KB (512K x 8) ; RAM Size: 128K x 8 ; Number of I /O: 102 ; Package / Case: 144-LQFP ; Speed: 100MHz ; Oscillator Type: Internal ; Packaging: Tray ; Program Memory Type: FLASH ; EEPROM Size: - ; Core Processor:
• Manufacturer: Freescale Semiconductor

1 Ordering parts...........................................................................4
2 Part identification......................................................................4
3 Terminology and guidelines......................................................5
4 Ratings......................................................................................9
5 General.....................................................................................11
Freescale Semiconductor, Inc.
1.1 Determining valid orderable parts......................................4
2.1 Description.........................................................................4
2.2 Format...............................................................................4
2.3 Fields.................................................................................4
2.4 Example............................................................................5
3.1 Definition: Operating requirement......................................5
3.2 Definition: Operating behavior...........................................6
3.3 Definition: Attribute............................................................6
3.4 Definition: Rating...............................................................7
3.5 Result of exceeding a rating..............................................7
3.6 Relationship between ratings and operating
3.7 Guidelines for ratings and operating requirements............8
3.8 Definition: Typical value.....................................................8
3.9 Typical value conditions....................................................9
4.1 Thermal handling ratings...................................................10
4.2 Moisture handling ratings..................................................10
4.3 ESD handling ratings.........................................................10
4.4 Voltage and current operating ratings...............................10
5.1 AC electrical characteristics..............................................11
5.2 Nonswitching electrical specifications...............................11
5.3 Switching specifications.....................................................19
5.4 Thermal specifications.......................................................20
requirements......................................................................7
5.2.1
5.2.2
5.2.3
5.2.4
5.2.5
5.2.6
5.2.7
5.2.8
5.3.1
5.3.2
5.4.1
Voltage and current operating requirements.........11
LVD and POR operating requirements.................13
Voltage and current operating behaviors..............13
Power mode transition operating behaviors..........14
Power consumption operating behaviors..............15
EMC radiated emissions operating behaviors.......18
Designing with radiated emissions in mind...........19
Capacitance attributes..........................................19
Device clock specifications...................................19
General switching specifications...........................19
Thermal operating requirements...........................20
K30 Sub-Family Data Sheet Data Sheet, Rev. 6, 9/2011.
Table of Contents
6 Peripheral operating requirements and behaviors....................21
7 Dimensions...............................................................................61
8 Pinout........................................................................................61
9 Revision History........................................................................69
6.1 Core modules....................................................................22
6.2 System modules................................................................25
6.3 Clock modules...................................................................25
6.4 Memories and memory interfaces.....................................31
6.5 Security and integrity modules..........................................36
6.6 Analog...............................................................................36
6.7 Timers................................................................................51
6.8 Communication interfaces.................................................51
6.9 Human-machine interfaces (HMI)......................................58
7.1 Obtaining package dimensions.........................................61
8.1 K30 Signal Multiplexing and Pin Assignments..................61
8.2 K30 Pinouts.......................................................................67
5.4.2
6.1.1
6.1.2
6.3.1
6.3.2
6.3.3
6.4.1
6.4.2
6.4.3
6.6.1
6.6.2
6.6.3
6.6.4
6.8.1
6.8.2
6.8.3
6.8.4
6.8.5
6.8.6
6.8.7
6.9.1
6.9.2
Thermal attributes.................................................21
Debug trace timing specifications.........................22
JTAG electricals....................................................22
MCG specifications...............................................25
Oscillator electrical specifications.........................28
32kHz Oscillator Electrical Characteristics............30
Flash (FTFL) electrical specifications....................31
EzPort Switching Specifications............................33
Flexbus Switching Specifications..........................33
ADC electrical specifications.................................36
CMP and 6-bit DAC electrical specifications.........44
12-bit DAC electrical characteristics.....................47
Voltage reference electrical specifications............50
CAN switching specifications................................51
DSPI switching specifications (limited voltage
range)....................................................................52
DSPI switching specifications (full voltage range).53
I2C switching specifications..................................55
UART switching specifications..............................55
SDHC specifications.............................................55
I2S switching specifications..................................56
TSI electrical specifications...................................58
LCD electrical characteristics................................59
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