k4t51163qi-hpf7 Samsung Semiconductor, Inc., k4t51163qi-hpf7 Datasheet - Page 6
![no-image](/images/no-image-200.jpg)
k4t51163qi-hpf7
Manufacturer Part Number
k4t51163qi-hpf7
Description
512mb I-die Ddr2 Sdram
Manufacturer
Samsung Semiconductor, Inc.
Datasheet
1.K4T51163QI-HPF7.pdf
(42 pages)
- Current page: 6 of 42
- Download datasheet (810Kb)
K4T51163QI
3.2 FBGA Package Dimension (x16)
1.10 ± 0.10
0.35 ± 0.05
(Datum A)
(Datum B)
(Post reflow 0.50 ± 0.05)
84-∅0.45 Solder ball
G
M
#A1
A
B
C
D
E
F
H
K
N
P
R
J
L
0.2 M A B
9
8
0.80
7
0.80 x 8 =
Bottom
6 of 42
6
7.50 ± 0.10
7.50 ± 0.10
Top
(1.90)
5
6.40
1.60
4
(0.95)
3.20
3
2
MOLDING AREA
1
# A1 INDEX MARK
A
Industrial
B
Units : Millimeters
Rev. 1.0 August 2009
DDR2 SDRAM
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