afct-57d5anpz Avago Technologies, afct-57d5anpz Datasheet - Page 2

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afct-57d5anpz

Manufacturer Part Number
afct-57d5anpz
Description
Digital Diagnostic Sfp Small Form Pluggable , Low Voltage 3.3 V 25km, 1310nm Dfb, 8.5/4.25/2.125 Gbd Fibre Channel Rohs Compliant Digital Diagnostic Optical Transceiver
Manufacturer
Avago Technologies
Datasheet
Description,
As  an  enhancement  to  the  conventional  SFP  interface 
defined  in  SFF-8074i,  the  AFCT-57D5ANPZ  is  compliant 
to SFF-8472 (digital diagnostic interface for optical trans-
ceivers).  Using  the  2-wire  serial  interface  defined  in  the 
SFF-8472  MSA,  the  AFCT-57D5ANPZ  provides  real  time 
temperature,  supply  voltage,  laser  bias  current,  laser 
average output power and received input power. This in-
formation is in addition to conventional SFP base data. The 
digital diagnostic interface also adds the ability to disable 
the  transmitter  (TX_DISABLE),  monitor  for  Transmitter 
Faults (TX_FAULT), and monitor for Receiver Loss of Signal 
(RX_LOS).
Installation
The  AFCT-57D5ANPZ  can  be  installed  in  any  SFF-8074i 
compliant Small Form Pluggable (SFP) port regardless of 
host equipment operating status. The AFCT-57D5ANPZ is 
hot-pluggable, allowing the module to be installed while 
the host system is operating and on-line. Upon insertion, 
the  transceiver  housing  makes  initial  contact  with  the 
host board SFP cage, mitigating potential damage due to 
Electro-Static Discharge (ESD). 
Digital Diagnostic Interface and Serial Identification
The 2-wire serial  interface is  based  on  ATMEL AT24C01A 
series EEPROM protocol and signaling detail. Conventional 
EEPROM memory, bytes 0-255 at memory address 0xA0, 
is  organized  in  compliance  with  SFF-8074i.  New  digital 
diag  n ostic  information,  bytes  0-255  at  memory  address 
0xA2,  is  compliant  to  SFF-8472.  The  new  diagnostic  in-
formation provides the opportunity for Predictive Failure 
Identification, Com  p liance Prediction, Fault Isolation and 
Component Monitoring.
Predictive Failure Identification
The  AFCT-57D5ANPZ  predictive  failure  feature  allows  a 
host to identify potential link problems before system per-
formance is impacted. Prior identification of link problems 
enables a host to service an application via “fail over” to 
a  redundant  link  or  replace  a  suspect  device,  maintain-
ing system uptime in the process. For applications where 
ultra-high system uptime is required, a digital SFP provides 
a means to monitor two real-time laser metrics asso  c iated 
with  observing  laser  degradation  and  predicting  failure: 
average  laser  bias  current  (Tx_Bias)  and  average  laser 
optical power (Tx_Power).
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continued
Compliance Prediction
Compliance  prediction  is  the  ability  to  determine  if  an 
optical  transceiver  is  operating  within  its  operating  and 
environmental  requirements.  AFCT-57D5ANPZ  devices 
provide  real-time  access  to  transceiver  internal  supply 
voltage  and  temperature,  allowing  a  host  to  identify 
potential component compliance issues. Received optical 
power  is  also  available  to  assess  compliance  of  a  cable 
plant  and  remote  transmitter.  When  operating  out  of 
requirements, the link cannot guarantee error free trans-
mission.
Fault Isolation
The fault isolation feature allows a host to quickly pinpoint 
the  location  of  a  link  failure,  minimizing  downtime.  For 
optical links, the ability to identify a fault at a local device, 
remote device or cable plant is crucial to speeding service 
of an installation. AFCT-57D5ANPZ real-time monitors of 
Tx_Bias, Tx_Power, Vcc, Temperature and Rx_Power can be 
used to assess local transceiver current operating condi-
tions.  In  addition,  status  flags Tx_Disable  and  Rx  Loss  of 
Signal (LOS) are mirrored in memory and available via the 
two-wire serial interface.
Component Monitoring
Component evaluation is a more casual use of the AFCT-
57D5ANPZ  real-time  monitors  of  Tx_Bias,  Tx_Power, 
Vcc,  Temperature  and  Rx_Power.  Potential  uses  are  as 
debugging  aids  for  system  installation  and  design,  and 
transceiver  parametric  evaluation  for  factory  or  field 
qualification. For example, temperature per module can be 
observed in high density applications to facilitate thermal 
evaluation of blades, PCI cards and systems.

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