mc56f801 Freescale Semiconductor, Inc, mc56f801 Datasheet - Page 92

• Manufacturer Part Number: mc56f801
• Description: 16-bit Digital Signal Controllers
• Manufacturer: Freescale Semiconductor, Inc

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Per JEDEC JESC51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per
7. See
92
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
measured on the top surface of the board near the package.
1012.1).
JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
Section 12.1
Junction to ambient
Natural convection
Junction to ambient
Natural convection
Junction to ambient
(@200 ft/min)
Junction to ambient
(@200 ft/min)
Junction to board
Junction to case
Junction to package top
Characteristic
for more details on thermal design considerations.
Table 10-3 LQFP Package Thermal Characteristics
Single layer board
(1s)
Four layer board
(2s2p)
Single layer board
(1s)
Four layer board
(2s2p)
Natural Convection
Comments
56F8014 Technical Data, Rev. 9
Symbol
R
R
R
R
R
R
Ψ
θJMA
θJMA
θJMA
θJC
θJA
θJB
JT
(LQFP)
Value
74
50
67
46
23
20
4
6
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Freescale Semiconductor
Notes
1,2
1,3
1,3
1,3
4
5
6
Preliminary