fsusb30 Fairchild Semiconductor, fsusb30 Datasheet

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fsusb30

Manufacturer Part Number
fsusb30
Description
Fsusb30 ? Low-power 2-port Hi-speed Usb 2.0 480mbps Switch
Manufacturer
Fairchild Semiconductor
Datasheet

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© 2006 Fairchild Semiconductor Corporation
FSUSB30 Rev. 1.1.5
FSUSB30
Low-Power 2-Port Hi-Speed USB 2.0 (480Mbps) Switch
Features
Applications
Related Application Notes
Ordering Information
Pb-Free package per JEDEC J-STD-020B.
Application Diagram
FSUSB30L10X
FSUSB30BQX
FSUSB30MUX
FSUSB30UMX
MicroPak™ is a trademark of Fairchild Semiconductor Corporation.
Low On Capacitance, 3.7pF (typical)
Low On Resistance, 6.5
Low power consumption (1µA maximum)
– 10µA maximum I
Wide -3dB bandwidth, >720MHz
8KV ESD protection
Power-Off protection when V
tolerate up to 5.25V
Packaged in:
– Pb-Free 10-lead MicroPak™ (1.6 x 2.1mm)
– Pb-Free 14-lead DQFN
– Pb-Free 10-lead MSOP
– Pb-Free 10-lead UMLP (1.4 x 1.8mm)
Cell phone, PDA, Digital Camera, and Notebook LCD
Monitor, TV, and Set-top Box
AN-6022 Using the FSUSB30 / FSUSB31 to Comply
with USB 2.0 Fault Condition Requirements
Number
voltage range (V
Order
Package
MAC010A
MLP014A
MLP010A
Number
MUA10A
IN
CCT
= 2.6V, V
Ohm
over an expanded control
Set Top Box
(STB) CPU
Processor
DSP
CC
(typical)
or
CC
Product Code
= 0V; D+/ D- pins can
= 4.3V)
Top Mark
FSUSB30
USB30
GJ
FJ
Mass Storage
Controller
Controller
USB2.0
DVR or
Pb-Free
Yes
Yes
Yes
Yes
1D+
1D–
2D+
2D–
General Description
The FSUSB30 is a low-power, two-port, high-speed USB
2.0 switch. Configured as a double-pole double-throw
(DPDT) switch, it is optimized for switching between two
high-speed (480Mbps) sources or a Hi-Speed and Full-
Speed (12Mbps) source. The FSUSB30 is compatible
with the requirements of USB2.0 and features an
extremely low on capacitance (C
bandwidth of this device (720MHz), exceeds the band-
width needed to pass the third harmonic, resulting in sig-
nals with minimum edge and phase distortion. Superior
channel-to-channel crosstalk minimizes interference.
The FSUSB30 contains special circuitry on the D+/ D-
pins which allows the device to withstand an overvoltage
condition when powered off. This device is also designed
to minimize current consumption even when the control
voltage applied to the S pin, is lower than the supply volt-
age (V
portable applications such as cell phones, allowing for
direct interface with the general purpose I/Os of the
baseband processor. Other applications include switch-
ing and connector sharing in portable cell phones, PDAs,
digital cameras, printers, and notebook computers.
V
CC
10-Lead MicroPak, 1.6 x 2.1mm
14-Terminal Depopulated Quad Very-Thin Flat Pack
No Leads (DQFN), JEDEC MO-241, 2.5 x 3.0mm
10-Lead Molded Small Outline Package (MSOP),
JEDEC MO-187, 3.0mm Wide
10-Lead, Quad, Ultrathin, MLP (UMLP) 1.4 x 1.8mm
FSUSB30
CC
Control
S
). This feature is especially valuable to ultra-
OE
D+
D–
Package Description
Connector
USB
ON
) of 3.7pF. The wide
Click to see this datasheet
in Simplified Chinese!
www.fairchildsemi.com
January 2007

Related parts for fsusb30

fsusb30 Summary of contents

Page 1

... Superior channel-to-channel crosstalk minimizes interference. The FSUSB30 contains special circuitry on the D+/ D- pins which allows the device to withstand an overvoltage condition when powered off. This device is also designed ...

Page 2

... Pin Assignment for MSOP S 1 HSD1+ 2 HSD2 GND 5 (Top Through View) Pad Assignments for µMLP (Top Through View) © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.5 Analog Symbol 6 GND 5 4 Pin Descriptions OE 13 D+, D−, HSDn+, HSDn− HSD1– HSD2– ...

Page 3

... Control Input Voltage IN V Switch Input Voltage SW T Operating Temperature A ΘJ Thermal Resistance, 10 MicroPak A Note: 2. Control input must be held HIGH or LOW and it must not float. © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.5 Parameter HSDnX (1) D+,D- when V > D+,D- when All Pins I/O to GND Parameter 3 ...

Page 4

... Turn-Off Time S, t OFF OE to Output (4) t Propagation Delay PD t Break-Before-Make BBM Off Isolation O IRR (Non-Adjacent) Non-Adjacent Channel Xtalk Crosstalk −3dB Bandwidth BW © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.5 Conditions I = -18mA 0. ≤ Dn, HSD1 ≤ HSD2 4.3V 0.4V, I ...

Page 5

... Guaranteed by characterization. Capacitance Symbol Parameter C Control Pin Input Capacitance Capacitance Off Capacitance OFF n n © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.5 V (V) Conditions 50Ω 5pF 3 50Ω 5pF 3 50Ω 5pF ...

Page 6

... Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.5 Frequency Response 10 100 1000 Frequency (MHz Figure 1. Gain vs. Frequency Frequency Response 10 100 Frequency (MHz) Figure 2. Off Isolation Frequency Response 10 100 Frequency (MHz) Figure 3. Crosstalk ...

Page 7

... (see AC Electrical tables for specific values). C includes test fixture and stray capacitance. L Figure 6. AC Test Circuit Load Input – Output – V © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1 GND = RISE D+, D– 800mV ...

Page 8

... OH 50% Output: D+, D– SK(P) Pulse Skew Sel GND R and (See AC Electrical Tables for specific values). © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.5 V D+, D– OUT Control Input Figure 9. Break-Before-Make (t t RISE 800mV Input: D+, D– ...

Page 9

... V Sel GND R and R S (50 100Ω) Crosstalk = 20 Log (V Figure 13. Non-Adjacent Channel-to-Channel Crosstalk FSUSB30 Dn Capacitance Meter f = 240MHz D1n, D2n Figure 14. Channel On Capacitance © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.5 FSUSB30 GND R T GND GND / V ) OUT IN Figure 12. Channel Off Isolation NC GND R T ...

Page 10

... HSD+ HSD+ HSD- HSD- Figure 16. Adding 100Ω resistor in series with the V For more information, see Applications Note AN-6022 Using the FSUSB30 to Comply with USB 2.0 Fault Condition Requirements at © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.5 Power-On Protection The USB 2.0 specification also notes that the USB device should be capable of withstanding a Vbus short during transmission of data ...

Page 11

... Tape and Reel Specifications Tape Format for MircoPak Package Designator Leader (Start End) L10X Trailer (Hub End) Tape Dimension Dimensions are in millimeters unless otherwise specified. © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.5 Tape Number Section Cavities 125 (typ) Carrier 5000 75 (typ) 11 ...

Page 12

... Reel Dimension for MircoPak Dimensions are in inches (millimeters) unless otherwise specified. Tape Size A B 7.0 0.059 (8mm) (177.8) (1.50) © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1 0.512 0.795 2.165 0.331 + 0.059/−0.000 (13.00) (20.20) (55.00) (8.40 + 1.50/−0.00 0.567 W1 + 0.078/−0.039 (14.40) (W1 + 2.00/−1.00) www.fairchildsemi.com ...

Page 13

... Tape Format for DQFN Package Designator Leader (Start End) BQX Trailer (Hub End) Tape Dimensions Dimenions are in millimeters unless otherwise specified. © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.5 Tape Number Section Cavities 125 (typ) Carrier 2500/3000 75 (typ) 13 Cavity Cover Tape Status ...

Page 14

... Reel Dimensions for DQFN Dimensions are in inches (millimeters) unless otherwise specified. Tape Size A 13.0 (12mm) (330) © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1 0.059 0.512 0.795 (1.50) (13.00) (20.20 7.008 0.488 0.724 (178) (12.4) (18.4) www.fairchildsemi.com ...

Page 15

... Tape Dimensions for MSOP Dimensions are in inches (millimeters) unless otherwise specified. Reel Dimensions for MSOP Dimensions are in inches (millimeters) unless otherwise specified Tape Size 0.059 (12mm) (330) (1.5) © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1 0.512 0.795 7.008 (13) (20.2) (178 ...

Page 16

... Physical Dimensions Dimensions are in millimeters unless otherwise specified. © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.5 Figure 17. 10-Lead MicroPak, 1.6 x 2.1mm 16 www.fairchildsemi.com ...

Page 17

... Physical Dimensions Dimensions are in millimeters unless otherwise specified. Figure 18. 14-Terminal De-populated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.0mm © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.5 17 www.fairchildsemi.com ...

Page 18

... Physical Dimensions Dimensions are in millimeters unless otherwise specified. Figure 19. 10-Lead Molded Small Outline Package (MSOP), JEDEC MO-187, 3.0mm Wide © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.5 18 www.fairchildsemi.com ...

Page 19

... Physical Dimensions Dimensions are in millimeters unless otherwise specified. Figure 20. 10-Lead, Quad, Ultrathin Molded Leadless Package (UMLP), 1.4 x 1.8mm © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.5 19 www.fairchildsemi.com ...

Page 20

... Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.5 20 www.fairchildsemi.com ...

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