uja1076tw/5v0/wd NXP Semiconductors, uja1076tw/5v0/wd Datasheet - Page 27

• Manufacturer Part Number: uja1076tw/5v0/wd
• Description: High-speed Can Core System Basis Chip
• Manufacturer: NXP Semiconductors

NXP Semiconductors
8. Thermal characteristics
UJA1076_1
Product data sheet
Fig 13. HTSSOP PCB
Layout conditions for R
layer, board dimensions 129 × 60 mm, board Material FR4, Cu thickness 0.070 mm, thermal via
separation 1.2 mm, thermal via diameter 0.3 mm ±0.08 mm, Cu thickness on vias 0.025 mm.
Optional heat sink top layer of 3.5 mm × 25 mm will reduce thermal resistance (see
PCB copper area:
(bottom layer)
2 cm
PCB copper area:
(bottom layer)
8 cm
2
2
Rev. 01 — 1 December 2009
th(j-a)
measurements: board finish thickness 1.6 mm ±10 %, board double
High-speed CAN core system basis chip
optional heatsink top layer
optional heatsink top layer
optional heatsink top layer
UJA1076
© NXP B.V. 2009. All rights reserved.
015aaa137
Figure
14).
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