mpc8379e Freescale Semiconductor, Inc, mpc8379e Datasheet - Page 108
mpc8379e
Manufacturer Part Number
mpc8379e
Description
Powerquicc Ii Pro Processor Hardware Specifications
Manufacturer
Freescale Semiconductor, Inc
Datasheet
1.MPC8379E.pdf
(117 pages)
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Thermal
Table 79
standard JEDEC environment, per JESD 51-6.
Heat sink vendors include the following:
108
Aavid Thermalloy
www.aavidthermalloy.com
Alpha Novatech
www.alphanovatech.com
International Electronic Research Corporation (IERC)
www.ctscorp.com
Millennium Electronics (MEI)
www.mei-thermal.com
Heat Sink Assuming Thermal Grease
shows the heat sink thermal resistance for TePBGA II package with heat sinks, simulated in a
Wakefield, 53
AAVID 30
AAVID 31
AAVID 43
Table 79. Thermal Resistance with Heat Sink in Open Flow (TePBGA II)
×
×
×
MPC8379E PowerQUICC II Pro Processor Hardware Specifications, Rev. 3
41
30
×
35
×
53
×
×
16.5mm Pin Fin
9.4 mm Pin Fin
×
23 mm Pin Fin
25 mm Pin Fin
Natural Convection
Natural Convection
Natural Convection
Natural Convection
Air Flow
0.5 m/s
0.5 m/s
0.5 m/s
0.5 m/s
1 m/s
2 m/s
4 m/s
1 m/s
2 m/s
4 m/s
1 m/s
2 m/s
4 m/s
1 m/s
2 m/s
4 m/s
Thermal Resistance
Freescale Semiconductor
(°/W)
10.6
11.1
11.3
13.1
9.3
8.2
7.5
8.5
7.7
7.2
6.8
9.0
7.8
7.0
6.5
9.7
7.7
6.8
6.4
6.1