mpc8349ea Freescale Semiconductor, Inc, mpc8349ea Datasheet - Page 53

• Manufacturer Part Number: mpc8349ea
• Description: Mpc8349ea Powerquicc
• Manufacturer: Freescale Semiconductor, Inc

18 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8349EA is available
in a tape ball grid array (TBGA). See
Section 18.2, “Mechanical Dimensions for the MPC8349EA
18.1
The package parameters are provided in the following list. The package type is 35 mm × 35 mm, 672 tape
ball grid array (TBGA).
Freescale Semiconductor
Package outline
Interconnects
Pitch
Module height (typical)
Solder balls
Ball diameter (typical)
Package Parameters for the MPC8349EA TBGA
MPC8349EA PowerQUICC™ II Pro Integrated Host Processor Hardware Specifications, Rev. 10
Section 18.1, “Package Parameters for the MPC8349EA TBGA”
672
1.00 mm
1.46 mm
62 Sn/36 Pb/2 Ag (ZU package)
96.5 Sn/3.5Ag (VV package)
0.64 mm
35 mm × 35 mm
TBGA.
Package and Pin Listings
and
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