tda8035hn NXP Semiconductors, tda8035hn Datasheet - Page 31

• Manufacturer Part Number: tda8035hn
• Description: Smart Card Interface
• Manufacturer: NXP Semiconductors

NXP Semiconductors
19. Tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
20. Figures
Fig 1.
Fig 2.
Fig 3.
Fig 4.
Fig 5.
Fig 6.
Fig 7.
Fig 8.
Fig 9.
Fig 10. Emergency deactivation sequence
Fig 11. Behavior of OFFN, CMDVCCN, PRESN
Fig 12. Definition of output and input transition times . . .23
Fig 13. Application diagram . . . . . . . . . . . . . . . . . . . . . . .24
Fig 14. Package outline SOT617-7 . . . . . . . . . . . . . . . . .25
TDA8035HN
Product data sheet
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Pin configuration HVQFN32 . . . . . . . . . . . . . . . . .5
Block voltage supervisor . . . . . . . . . . . . . . . . . . . .8
Voltage supervisor . . . . . . . . . . . . . . . . . . . . . . . . .9
Voltage supervisor . . . . . . . . . . . . . . . . . . . . . . . . .9
Switch external clock . . . . . . . . . . . . . . . . . . . . . .10
Shutdown mode and Deep Shutdown mode . . . .12
Activation sequence at t3 . . . . . . . . . . . . . . . . . .13
Deactivation sequence . . . . . . . . . . . . . . . . . . . .14
(Card extraction) . . . . . . . . . . . . . . . . . . . . . . . . .16
and Vcc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Quick reference data . . . . . . . . . . . . . . . . . . . . .2
Ordering information . . . . . . . . . . . . . . . . . . . . .3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .5
Clock configuration . . . . . . . . . . . . . . . . . . . . . .10
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . .17
Thermal characteristics . . . . . . . . . . . . . . . . . .17
All information provided in this document is subject to legal disclaimers.
Rev. 1.0 — 19 April 2011
Table 7.
Table 8.
Table 9.
Table 10. Revision history . . . . . . . . . . . . . . . . . . . . . . . . 28
Characteristics of IC . . . . . . . . . . . . . . . . . . . . 18
Suitability of surface mount IC packages
for wave and reflow soldering methods . . . . . . 27
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 27
TDA8035HN
Smart card interface
© NXP B.V. 2011. All rights reserved.
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