tda8035hn NXP Semiconductors, tda8035hn Datasheet - Page 17

• Manufacturer Part Number: tda8035hn
• Description: Smart Card Interface
• Manufacturer: NXP Semiconductors

NXP Semiconductors
9. Limiting values
10. Thermal characteristics
Table 6.
TDA8035HN
Product data sheet
Symbol
R
th(j-a)
Thermal characteristics
Package name Parameter
HVQFN32
All card contacts are protected against any short with any other card contact.
Stress beyond these levels may cause permanent damage to the device. This is a stress
rating only and functional operation of the device under this condition is not implied.
Table 5.
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
T
T
T
P
V
V
V
amb
stg
j
DDP
DD(INTF)
IH
tot
ESD
thermal resistance from junction
to ambient
Limiting values
Parameter
power supply voltage
interface supply voltage
High-level input voltage CS, PRESN,
ambient temperature
storage temperature
junction temperature
total power dissipation
electrostatic discharge
voltage
All information provided in this document is subject to legal disclaimers.
Rev. 1.0 — 19 April 2011
Conditions
CMDVCCN, CLKDIV2,
CLKDIV1, EN_1.8VN,
EN_5V/3VN, RSTIN,
OFFN, PORADJ, XTAL1,
I/OUC, AUX1UC, AUX2UC,
V
I/O, RST, AUX1, AUX2 and
CLK
T
Human Body Model (HBM)
on card pins I/O, RST, V
AUX1, CLK, AUX2, PRESN
within typical application
Human Body Model (HBM)
on all other pins
Machine Model (MM) on
all pins
Field Charged Device
Model (FCDM) on all pins
amb
DDP
Conditions
in free air with 4 thermal vias
on pcb
in free air without thermal
vias on pcb
, V
= −40 to +85 °C
DD(INTF)
CC
,
TDA8035HN
Min
−0.3
−0.3
−0.3
−0.3
−25
−55
−10
−2
−200
−500
Smart card interface
Typ
55
63
© NXP B.V. 2011. All rights reserved.
Max
6
4.1
4.1
5.75
+85
+150
+125
0.45
+10
+2
+200
+500
Unit
K/W
K/W
Unit
V
V
V
V
°C
°C
°C
W
kV
kV
V
V
17 of 32