tda8035hn NXP Semiconductors, tda8035hn Datasheet - Page 24

no-image

tda8035hn

Manufacturer Part Number
tda8035hn
Description
Smart Card Interface
Manufacturer
NXP Semiconductors
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TDA8035HN
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Company:
Part Number:
TDA8035HN
Quantity:
6 000
Part Number:
tda8035hn/C1
Manufacturer:
NXP
Quantity:
490
Part Number:
tda8035hn/C1
Manufacturer:
NXP
Quantity:
8 000
Part Number:
tda8035hn/C1
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
tda8035hn/C1
0
Company:
Part Number:
tda8035hn/C1
Quantity:
2 680
Company:
Part Number:
tda8035hn/C1,118
Quantity:
17 250
Part Number:
tda8035hn/C1/S1J
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
tda8035hn/C2/S1
0
Part Number:
tda8035hn/C2/S1J
0
NXP Semiconductors
12. Application information
TDA8035HN
Product data sheet
Fig 13. Application diagram
V
DD(INTF)
(1) Place close to the protected pin with good (low resistive) and straight connection to the main ground.
(2) Place close to the supply pin with good (low resistive) and straight connection to GNDP.
(3) Place close to TDA8035´s VCC pin with good connection to GNDC.
(4) Place close to card connector´s C1 (VCC) pinwidth good connection to GNDC.
(5) Optional bridge. If not used, R1 must be O Ohm and R2 absent (direct connection to VDDI).
(6) GNDP and GNDC must be connected to the main ground with a straight and low resistive connection
VDDI
R1 (5)
R2 (5)
100 nF (1)
C1
VDDI
CMDVCCN
VDD(INTF)
EN5V_3V
CLKDIV1
CLKDIV2
PORADJ
EN_1.8V
I/OUC
1
2
3
4
5
6
7
8
56 pF
C10
All information provided in this document is subject to legal disclaimers.
V
DD(INTF)
TDA8035
Rev. 1.0 — 19 April 2011
C2
100 nF (1)
220 nF (3)
24
23
22
21
20
19
18
17
CLK
RST
VCC
VUP
SAP
SBP
VDDP
SBM
C8
1 μF (2)
330 nF
330 nF
C5
C4
C3
0 Ω
R
C6 (2)
100 nF
C5
C6
C7
C8
CONNECTOR
C7 (2)
10 μF
TDA8035HN
CARD
VDD
Smart card interface
C1
C2
C3
C4
© NXP B.V. 2011. All rights reserved.
C9 (4)
220 nF
VDDI
001aan759
24 of 32

Related parts for tda8035hn