H11AV1 Fairchild Semiconductor, H11AV1 Datasheet
H11AV1
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H11AV1 Summary of contents
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... The general purpose optocouplers consist of a gallium arsenide infrared emitting diode driving a silicon phototransistor in a 6-pin dual in-line white package. FEATURES • H11AV1 and H11AV2 feature 0.3" input-output lead spacing • H11AV1A and H11AV2A feature 0.4" input-output lead spacing • UL recognized (File #E90700, Vol. 2) • VDE recognized (File #102497) - Add option V (e.g., H11AV1AV-M) APPLICATIONS • ...
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... H11AV1-M H11AV1A-M ABSOLUTE MAXIMUM RATINGS Parameter TOTAL DEVICE Storage Temperature Operating Temperature Wave solder temperature (see page 9 for reflow solder profiles) Total Device Power Dissipation @ T A Derate above 25°C EMITTER DC/Average Forward Input Current Reverse Input Voltage LED Power Dissipation @ T = 25° ...
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... H11AV1-M H11AV1A-M ELECTRICAL CHARACTERISTICS INDIVIDUAL COMPONENT CHARACTERISTICS Parameter EMITTER Input Forward Voltage ( mA) F Reverse Leakage Current DETECTOR Collector-Emitter Breakdown Voltage Collector-Base Breakdown Voltage Emitter-Collector Breakdown Voltage Collector-Emitter Dark Current Collector-Base Dark Current Capacitance ISOLATION CHARACTERISTICS Characteristic Input-Output Isolation Voltage Isolation Resistance ...
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... Test Conditions Symbol = 10 V) CTR mA mA (SAT) = 100 Ω (Fig. 11) = 100 Ω (Fig. 11) Page H11AV2A-M Device Min Typ* Max H11AV1 100 300 H11AV1A H11AV2 50 H11AV2A All 0.4 All 15 All 15 Unit % V µs µs 6/30/03 ...
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... H11AV1-M H11AV1A-M TYPICAL PERFORMANCE CURVES Fig. 1 LED Forward Voltage vs. Forward Current 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1 LED FORWARD CURRENT (mA) F Fig. 3 Normalized CTR vs. Ambient Temperature 1.4 1.2 1.0 0.8 0 Normalized to 0 25°C A 0.2 -60 -40 - AMBIENT TEMPERATURE (°C) A Fig. 5 CTR vs. RBE (Saturated) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 BASE RESISTANCE (k Ω) ...
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... H11AV1-M H11AV1A-M Fig. 7 Switching Speed vs. Load Resistor 1000 25°C A 100 T off 0.1 0.1 1 R-LOAD RESISTOR (kΩ) Fig. 9 Normalized t 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 10 100 1000 - BASE RESISTANCE (k Ω TEST CIRCUIT I F INPUT R BE © 2003 Fairchild Semiconductor Corporation ...
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... H11AV1-M H11AV1A-M Package Dimensions (Through Hole) 0.350 (8.89) 0.320 (8.13) Pin 1 ID 0.260 (6.60) 0.240 (6.10) 0.070 (1.77) 0.040 (1.02) 0.014 (0.36) 0.010 (0.25) 0.200 (5.08) 0.115 (2.93) 0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.100 (2.54) 0.016 (0.41) Package Dimensions (0.4” Lead Spacing) 0.350 (8.89) 0.320 (8.13) PIN 1 ID 0.260 (6.60) 0.240 (6.10) 0.070 (1.77) 0.040 (1.02) 0.014 (0.36) 0.010 (0.25) 0.200 (5.08) 0.115 (2.93) 0.100 (2.54) ...
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... See order entry table) One digit year code • One digit for white package parts, e.g., ‘3’ Two digit work week ranging from ‘01’ to ‘53’ Assembly package code Page H11AV2A-M Example H11AV1S-M H11AV1SR2-M H11AV1A-M H11AV1V-M H11AV1AV-M H11AV1SV-M H11AV1SR2V 6/30/03 ...
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... H11AV1-M H11AV1A-M Carrier Tape Specifications 4.5 ± 0.20 0.30 ± 0.05 21.0 ± 0.1 0.1 MAX Reflow Profile 300 250 245°C peak 200 150 Time above 183°C, 120–180 sec 100 Ramp up = 2–10°C/sec 0.5 1 1.5 2 Time (Minute) © 2003 Fairchild Semiconductor Corporation ...
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... H11AV1-M H11AV1A-M DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. ...