FODM8801X Fairchild Semiconductor, FODM8801X Datasheet - Page 13

• Manufacturer Part Number: FODM8801X
• Manufacturer: Fairchild Semiconductor

©2010 Fairchild Semiconductor Corporation
FODM8801X Rev. 1.0.8
Reflow Profile
Temperature Min. (Tsmin)
Temperature Max. (Tsmax)
Time (t
Ramp-up Rate (t
Liquidous Temperature (T
Time (t
Peak Body Package Temperature
Time (t
Ramp-down Rate (T
Time 25°C to Peak Temperature
260
240
220
200
180
160
140
120
100
245
80
60
40
20
0
T
T
S
L
P
L
P
) Maintained Above (T
) from (Tsmin to Tsmax)
) within 5°C of 260°C
Tsmax
Tsmin
Profile Freature
Max. Ramp-down Rate = 6°C/S
Max. Ramp-up Rate = 3°C/S
L
to t
P
P
to T
)
120
L
L
)
)
L
Time 25°C to Peak
)
Time (seconds)
13
t
Pb-Free Assembly Profile
s
240
245°C +0°C / –5°C
3°C/second max.
6°C/second max.
60–120 seconds
60–150 seconds
8 minutes max.
30 seconds
150°C
200°C
217°C
t
L
t
P
360
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