UPD78320GJ-5BJ NEC, UPD78320GJ-5BJ Datasheet - Page 78

• Manufacturer Part Number: UPD78320GJ-5BJ
• Description: 16/8-BIT SINGLE-CHIP MICROCONTROLLER
• Manufacturer: NEC

78
11. RECOMMENDED SOLDERING CONDITIONS
Technology Manual” (IE-1207).
Caution Use more than one soldering method should be avoided (except in the case of pin part heating).
Infrared reflow
VPS
Wave soldering
Pin part heating
PD78320L
PD78322L-
PD78320GF-3B9
PD78322GF-
PD78320GJ-5BJ
PD78322GJ-
Infrared reflow
VPS
Pin part heating
Soldering Method
Soldering Method
The PD78322 should be soldered and mounted under the conditions recommended in the table below.
For detail of recommended soldering conditions, refer to the information document “Semiconductor Device Mounting
For soldering methods and conditions other than those recommended below, contact our salesman.
: 68-pin plastic QFJ (
: 68-pin plastic QFJ (
-5BJ : 74-pin plastic QFP (20
-3B9 : 80-pin plastic QFP (14
Package peak temperature: 235 C, Time: 30 sec. max. (at 210 C or above),
Number of times: twice or less
<Caution>
(1) The second reflow should be started after the temperature of the device which
(2) Please avoid flux water washing after the first reflow.
Package peak temperature: 215 C, Time: 40 sec. max. (at 200 C or above),
Number of times: twice or less
<Caution>
(1) The second reflow should be started after the temperature of the device which
(2) Please avoid flux water washing after the first reflow.
Solder bath temperature: 260 C max. Time: 10 sec. max., Number of times: Once
Preheating temperature: 120 C max. (package surface temperature)
Pin temperature: 300 C max. Time: 3 sec. max. (Per device side)
Package peak temperature: 230 C, Time: 30 sec. max. (at 210 C or above),
Number of times: Once
Package peak temperature: 215 C, Time: 40 sec. max. (at 200 C or above),
Number of times: Once
Pin part temperature: 300 C max. Time: 3 sec. max. (Per device side)
: 80-pin plastic QFP (14
: 74-pin plastic QFP (20
would have been changed by the first reflow has returned to normal.
would have been changed by the first reflow has returned to normal.
Table 11-1. Soldering Conditions for Surface Mount Type
950 mil)
950 mil)
Soldering Conditions
Soldering Conditions
20 mm)
20 mm)
20 mm)
20 mm)
PD78320, 78322
Condition Symbol
Condition Symbol
Recommended
Recommended
VP15-00-2
WS60-00-1
IR30-00-1
VP15-00-1
IR35-00-2