T35L6432A TM Technology Inc., T35L6432A Datasheet

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T35L6432A

Manufacturer Part Number
T35L6432A
Description
64k X 32 Sram 3.3v Supply, Fully Registered Inputs And Outputs, Burst Counter
Manufacturer
TM Technology Inc.
Datasheet

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tm
SYNCHRONOUS
BURST SRAM
FEATURES
¡E F ast Access times: 4.5, 5, 6, 7, and 8ns
¡E F ast clock speed: 125,100, 83, 66, and 50 MHz
¡E P rovide high performance 3-1-1-1 access rate
¡E F ast
¡E S ingle 3.3V +10%/-5% power supply
¡E C ommon data inputs and data outputs
¡E B YTE WRITE ENABLE and GLOBAL WRITE
¡E T hree chip enables for depth expansion and
¡E A ddress, control, input, and output pipelined
¡E I nternally self-timed WRITE CYCLE
¡E W RITE pass-through capability
¡E B urst control pins ( interleaved or linear burst
¡E H igh density, high speed packages
¡E L ow capacitive bus loading
¡E H igh 30pF output drive capability at rated access
¡E S NOOZE MODE for reduced power standby
¡E Single cycle disable ( Pentium
OPTIONS
Part Number Examples
Taiwan Memory Technology, Inc. reserves the right
to change products or specifications without notice.
T35L6432A-5Q
T35L6432A-5T
PART NO.
control
address pipelining
registers
sequence)
time
compatible )
TIMING
Package
4.5ns access/8ns cycle
5ns access/10ns cycle
6ns access/12ns cycle
7ns access/15ns cycle
8ns access/20ns cycle
100-pin QFP
100-pin TQFP
OE
access times: 4.5, 5 and 6ns
CH
TE
Pkg. BURST SEQUENCE
Q
T
Interleaved
(MODE=NC or VCC)
Linear (MODE=GND)
TM
BSRAM
MARKING
-8
Q
T
-4.5
-5
-6
-7
P. 1
64K x 32 SRAM
3.3V supply, fully registered inputs and
outputs, burst counter
PIN ASSIGNMENT (Top View)
GENERAL DESCRIPTION
Burst RAM family employs: high-speed, low power
CMOS
polysilicon, double-layer metal technology. Each
memory cell consists of four transistors and two
high valued resistors.
SRAM cells with advanced synchronous peripheral
circuitry and a 2-bit counter for internal burst
operation. All synchronous inputs are gated by
registers controlled by a positive-edge-triggered
clock input (CLK). The synchronous inputs include
all addresses, all data inputs, address-pipelining
VCCQ
VCCQ
VCCQ
VCCQ
VSSQ
VSSQ
VSSQ
VSSQ
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
DQ32
VCC
VSS
NC
NC
NC
NC
The Taiwan Memory Technology Synchronous
The T35L6432A SRAM integrates 65536 x 32
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
1
2
3
4
5
6
7
8
9
100 99 98 97
31
32
design
33
34
96
35
95
36
100-pin TQFP
100-pin QFP
94
37
using
93
38
Publication Date: DEC. 1998
92
39
91
40
or
90
41
advanced
89
42
88 87 86 85 84 83 82 81
43
T35L6432A
44
45
46
47
Revision: A
48
triple-layer
49
50
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
VCCQ
VSSQ
VSSQ
VCCQ
VCCQ
VSSQ
VSSQ
VCCQ
DQ16
DQ15
DQ14
DQ13
DQ12
DQ11
DQ10
DQ9
VCC
DQ8
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
DQ1
VSS
NC
NC
NC
ZZ

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T35L6432A Summary of contents

Page 1

... Each memory cell consists of four transistors and two Q high valued resistors. T The T35L6432A SRAM integrates 65536 x 32 SRAM cells with advanced synchronous peripheral circuitry and a 2-bit counter for internal burst operation. All synchronous inputs are gated by registers controlled by a positive-edge-triggered clock input (CLK) ...

Page 2

... DQ17-DQ BW4 controls DQ25-DQ32. BW3 BW4 , , and can be active only with GW being LOW. being LOW causes all WRITE pass-through The T35L6432A operates systems and for systems that are benefited 32 32 OUTPUT OUTPUT 64K SENSE REGISTERS BUFFERS MEMORY AMPS ...

Page 3

... READ cycle is initiated using the new address. Input- Address Status Controller:This active LOW input causes device to registered. A READ or WRITE cycle is initiated depending upon write control inputs T35L6432A DESCRIPTION being LOW. lines and must meet . This input is ADSP Publication Date: DEC. 1998 ...

Page 4

... DQ9-DQ16. Third Byte is DQ17-DQ24. Fourth Byte is DQ25- DQ32. Input data must meet setup and hold times around the rising edge of CLK. Supply Power Supply: 3.3V +10%/-5% Ground Ground: GND - No Connect: These signals are not internally conntected T35L6432A DESCRIPTION Publication Date: DEC. 1998 Revision:A ...

Page 5

... PRESENT CYCLE OPERATION BWn Register A(n), Q= D(n- D(n- HIGH D(n-1) for one byte P. 5 T35L6432A Fourth Address (internal) (internal) A...A10 A...A11 A...A11 A...A10 A...A00 A...A01 A...A01 A...A00 Fourth Address (internal) (internal) A...A10 A...A11 A...A11 A...A00 A...A00 A...A01 A...A01 A ...

Page 6

... BW1 BW2 BW3 , , BW2 = enables write to DQ9-DQ16. =enables write to DQ25-DQ32. OE must meet setup and hold times around the rising edge ( LOW to HIGH) OE and staying HIGH throughout the input data hold P. 6 T35L6432A ...

Page 7

... Icc 200 300 270 230 190 150 I SB1 56 155 140 125 115 110 ADSP , BWE , all VCC - 0. SB3 SB4 T35L6432A This is a stress rating only and Exposure to absolute maximum rating MIN MAX UNITS 2 VCCQ + 0.3 V -0.3 0.8 ...

Page 8

... OEHZ 2 AAS CES 2 0.5 0.5 0.5 t AAH 0.5 0 0.5 0 0.5 0.5 t CEH 0.5 0 T35L6432A TYP MAX UNITS NOTES SYM. QFP TYP UNITS ...

Page 9

... C and 20ns cycle time. 14.MODE pin has an internal pull-up and exhibits an input leakage current 1.5V DQ 351 P. 9 T35L6432A ADSP LOW along with chip is a "don't care" when a byte write enable 3.3V 317 5 pF Publication Date: DEC. 1998 ...

Page 10

... SYMBOL SB2 KC) t RZZ Vss + 0 T35L6432A is guaranteed after the setup time SB2 Any access pending when entering MIN MAX UNITS KC N'T CARE Vcc -0.2 V). Publication Date: DEC. 1998 ...

Page 11

... OEL Q(A 2+1) KQ (NOT E1 T35L6432A A 3 Bur st con tin ase ss. Des ele ct cy cle 2+2) Q( Q(A2 2+1) Bu rst und ita l sta te. BUR ...

Page 12

... ( D(A2) D(A2+1) D(A2+1) (NOT RIT T35L6432A exte rst . D(A2 +2) D(A2+3 ) D(A3 ) D(A3+1) E xte RST W RIT E ...

Page 13

... OELZ D( RIT E Pas s -th r ough REA T35L6432A A5 D E1) Q(A4) Q(A4+ BURST REA D Back-to-Back Publication Date: DEC. 1998 A 6 D(A6) W RIT Es DO N'T CARE UNDEFINED Revision:A ...

Page 14

... Taiwan Memory Technology, Inc. reserves the right to change products or specifications without notice. Preliminary T35L6432A DIMENTION IN MM 3.302(MAX) 2.845¡Ó 0 .127 0.102(MIN) 0.300+0.102-0.051 14.000¡Ó 0 .127 20.000¡Ó 0 .127 0.650¡Ó 0 .152 17.200¡ ...

Page 15

... Taiwan Memory Technology, Inc. reserves the right to change products or specifications without notice. Preliminary T35L6432A DIMENTION IN MM 1.600(MAX) 1.400¡Ó 0 .050 0.050(MIN) 0.320+0.060-0.100 14.000¡Ó 0 .100 20.000¡Ó 0 .100 0.650¡ ...

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