TS68040 ATMEL Corporation, TS68040 Datasheet - Page 9

• Manufacturer Part Number: TS68040
• Description: 32-bit Mpu, 25-33 MHZ
• Manufacturer: ATMEL Corporation

Table 4 - Absolute maximum ratings
3.3.2 - Recommended conditions of use
Table 5
Unless otherwise stated, all voltages are referenced to the reference terminal (see § A.3).
3.4 - Thermal considerations
3.4.1 - General thermal considerations
This section is given for information only of user.
As microprocessors are becoming more complex and requiring more power, the need to efficiently cool the device becomes
increasingly more important. In the past, the TS 68000 Family, has been able to provide a 0-70°C ambient temperature part
for speeds less than 40 MHz. However, the TS 68040, which has a 50 MHz arithmetic logic unit (ALU) speed, is specified
with a maximum power dissipation for a particular mode, a maximum junction temperature, and a thermal resistance from
the die junction to the case. This provides a more accurate method of evaluating the environment, taking into consideration
both the air-flow and ambient temperature available. This also allows a user the information to design a cooling method
which meets both thermal performance requirements and constraints of the board environment.
This section discusses the device charateristics for thermal management, several methods of thermal management, and an
example of one method of cooling the TS 68040.
Note : This device is not tested at T C = + 125°C. Testing is performed by setting the junction temperature T j = + 125°C
Note :
Note :
Note : This device is not tested at T C = + 125°C. Testing is performed by setting the junction temperature T J = + 125°C
Note :
Note :
Symbol
Symbol
T lead
V CC
V CC
V OH
T stg
V OL
V IH
V IL
P D
T C
T C
T J
T J
V I
f c
and allowing the case and ambient temperatures to rise and fall as necessary so as not to exceed the maximum
junction temperature.
and allowing the case and ambient temperatures to rise and fall as necessary so as not to exceed the maximum
junction temperature.
Supply voltage range
Input voltage range
Power dissipation
Operating temperature
Storage temperature range
Junction temperature (see Note)
Lead temperature
Supply voltage range
Logic low level input voltage range
Logic high level input voltage range
High level output voltage
Low level output voltage
Clock frequency
Case operating temperature range (see Note)
Maximum operating junction temperature
Parameter
Parameter
– 25 MHz version
– 33 MHz version
Large buffers enabled
Small buffers enabled
Max.10 sec soldering
Condition
+ 4.75
– 0.3
+ 2.0
GND
– 55
Min.
2.4
– 0.3
– 0.3
– 55
– 65
Min.
Typ.
25
33
+ 150
+ 300
+ 125
Max.
T Jmax
+ 5.25
7.0
7.0
7.7
6.3
+ 125
T J
+ 0.3
Max.
VCC
0.8
0.5
Unit
MHz
MHz
Unit
°C
°C
°C
°C
W
W
V
V
°C
°C
V
V
V
V
V
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