MD3331-D32-V3Q18 M-Systems Inc., MD3331-D32-V3Q18 Datasheet - Page 41

• Manufacturer Part Number: MD3331-D32-V3Q18
• Description: Mobile Diskonchip Plus 128Mbits 1.8V I/o
• Manufacturer: M-Systems Inc.

9.2
9.2.1 Standard Interface
Mobile DiskOnChip Plus uses an SRAM-like interface that can easily be connected to any microprocessor bus. With
a standard interface, it requires 13 address lines, 8 data lines and basic memory control signals (CE#, OE#, WE#), as
shown in Figure 14 below. Typically, Mobile DiskOnChip Plus can be mapped to any free 8KB memory space. In a
PC compatible platform, it is usually mapped into the BIOS expansion area. If the allocated memory window is
larger than 8KB, an automatic anti-aliasing mechanism prevents the firmware from being loaded more than once
during the ROM expansion search.
Notes: 1.
41
System Interface
2.
3.
The 0.1 µF and the 10 nF low-inductance high-frequency capacitors must be attached to each of the
device’s VCC and VSS balls. These capacitors must be placed as close as possible to the package
leads.
Mobile DiskOnChip Plus is an edge-sensitive device. CE#, OE# and WE# should be properly
terminated (according to board layout, serial parallel or both terminations) to avoid signal ringing.
All capacities support the standard interface.
Output Enable
Write Enable
Chip Enable
Address
Chip ID
Reset
Data
0.1 uF
Figure 14: Standard System Interface
A[12:0]
D[15:0]
OE#
ID[1:0]
CE#
WE#
RSTIN#
10 nF
Mobile DiskOnChip
Data Sheet, Rev. 1.7
VCC
3.3 V
0.1 uF
Plus
VSS
IF_CFG
BUSY#
LOCK#
VCCQ
10 nF
BHE#
IRQ
1.8V/3.3V
Mobile DiskOnChip Plus 16/32MByte 1.8V I/O
1-20KOhm
Busy
95-SR-000-10-8L