DSPIC30F5013 Microchip Technology Inc., DSPIC30F5013 Datasheet - Page 211

• Manufacturer Part Number: DSPIC30F5013
• Description: Dspic30f5011/5013 High-performance Digital Signal Controllers
• Manufacturer: Microchip Technology Inc.

80-Lead Plastic Thin-Quad Flatpack (PT) 12x12x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
© 2006 Microchip Technology Inc.
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
JEDEC Equivalent: MS-026
Drawing No. C04-092
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
c
B
See ASME Y14.5M
See ASME Y14.5M
p
Dimension Limits
#leads=n1
E1
E
Units
CH
n1
A2
E1
D1
A1
n
p
L
F
E
D
B
A
c
n
MIN
.039
.037
.002
.018
.004
.007
.025
2
1
D1
0°
5°
5°
CH x 45°
.039 REF.
L
.020 BSC
.551 BSC
.551 BSC
.472 BSC
.472 BSC
INCHES
D
NOM
.043
.004
.024
.006
.035
A1
.039
.009
3.5°
10°
10°
80
20
A
dsPIC30F5011/5013
MAX
.047
.006
.030
.008
.045
.041
.011
15°
15°
F
7°
MIN
1.00
0.95
0.05
0.45
0.09
0.17
0.64
0°
5°
5°
MILLIMETERS*
14.00 BSC
14.00 BSC
12.00 BSC
12.00 BSC
1.00 REF.
0.50 BSC
NOM
1.10
1.00
0.10
0.60
0.15
0.22
0.89
3.5°
Revised 07-22-05
10°
10°
80
20
A2
DS70116F-page 209
MAX
1.14
1.20
1.05
0.15
0.75
0.20
0.27
15°
15°
7°