HM-6551 Intersil Corporation, HM-6551 Datasheet - Page 9

• Manufacturer Part Number: HM-6551
• Description: 256 X 4 Cmos Ram
• Manufacturer: Intersil Corporation

Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
GLASSIVATION:
Metallization Mask Layout
NOTE: Pin numbers correspond to DIP Package only.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
132 x 160 x 19 1mils
Type: Si - Al
Thickness: 11k
Type: SiO
Thickness: 8k
VCC
A4
A3
A2
A1
W
2
Å
Å
1k
2k
Å
Å
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A0
S1
HM-6551/883
HM-6551/883
6-109
WORST CASE CURRENT DENSITY:
LEAD TEMPERATURE (10s soldering):
1.337 x 10
A5
300
A6
o
C
E
5
A/cm
2
S2
A7
Q3
GND
D3
Q2
D2
Q1
D1
Q0
D0