S1D10605 Epson Electronics America, Inc., S1D10605 Datasheet - Page 609

• Manufacturer Part Number: S1D10605
• Description: S1d15000 Series Lcd Driver With Ram
• Manufacturer: Epson Electronics America, Inc.

S1D15B01 Series
12. CAUTION
Please be advised on the following points in the use of
this development specification.
1. This development specification is subject to change
without previous notice.
2. This development specification does not guarantee or
furnish the industrial property right not its execution.
3. No part of this development specification may not be
In handling of semiconductor devices, your attention is
required to following points.
13–54
Application examples in this development
specification are intended to ensure your better
understanding of the product. Thus the manufacturer
shall not be liable for any trouble arising in your
circuits from using such application example.
Numerical values provided in the property table of
this manual are represented with their magnitude on
the numerical line.
reproduced, copied or used for commercialpurpose
without a written permission from the manufacturer.
EPSON
[Precaution on light]
[Precautions when installing the COG]
Property of semiconductor devices may be affected
when they are exposed to light, possibly resulting in
malfunctioning of the ICs. To prevent such
malfunctioning of the ICs mounted on the boards or
products, make sure that:
(1) Your design and mounting layout done are so that
the IC is not exposed to light in actual use.
(2) The IC is protected from light in the inspection
process.
(3) The IC is protected from light in its front, rear and
side faces.
When installing the COG, it is necessary to duly
consider the fact that there exists a resistance of the
ITO wiring occurring between the driver chip and the
externally connected parts (such as capacitors and
resistors). By the influence of this resistance, non-
conformity may occur with the indications on the
liquid crystal display.
Therefore, when installing the COG design the module
paying sufficient considerations to the following three
points.
1. Suppress the resistance occurring between the
2. Suppress the resistance connecting to the power
3. Make various COG module samples with different
driver chip pin to the externally connected parts
as much as possible.
supply pin of the driver chip.
ITO sheet resistance to select the module with the
sheet resistance with sufficient operation margin.
Rev. 1.1a