FPF1203 Fairchild Semiconductor, FPF1203 Datasheet - Page 9

• Manufacturer Part Number: FPF1203
• Manufacturer: Fairchild Semiconductor

© 2011 Fairchild Semiconductor Corporation
FPF1203 / FPF1204 • Rev. 1.1.4
Physical Dimensions
Product-Specific Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
INDEX AREA
FPF1203UCX
FPF1204UCX
Product
BALL A1
2X
0.05 C
0.03 C
0.40
C
0.40
BOTTOM VIEW
TOP VIEW
1 2
E
Figure 23. 4-Bump, 0.76 x 0.76mm, Wafer-Level Chip-Scale Packaging
760µm ± 30µm
760µm ± 30µm
SEATING PLANE
B
A
(X)±0.018
A
0.539
0.461
Ø0.260±0.020
4X
D
D
B
D
2X
(Y)±0.018
0.06 C
F
0.005
0.03 C
F
E
C A B
760µm ± 30µm
760µm ± 30µm
SIDE VIEWS
E
NOTES:
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE
D. DATUM C IS DEFINED BY THE SPHERICAL
E. PACKAGE NOMINAL HEIGHT IS 500 MICRONS
F. FOR DIMENSIONS D, E, X, AND Y SEE
G. DRAWING FILNAME: MKT-UC004AFrev1.
A. NO JEDEC REGISTRATION APPLIES.
±39 MICRONS (461-539 MICRONS).
9
PER ASME Y14.5M, 1994.
CROWNS OF THE BALLS.
PRODUCT DATASHEET.
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
0.180mm± 0.018µm
0.180mm± 0.018µm
0.40
0.40
A1
X
0.292±0.018
0.208±0.021
Ø0.30
Solder Mask
Ø0.20
Cu Pad
0.180mm± 0.018µm
0.180mm± 0.018µm
www.fairchildsemi.com
Y