FAN2560 Fairchild Semiconductor, FAN2560 Datasheet - Page 10

• Manufacturer Part Number: FAN2560
• Description: The FAN2560 is a linear low-dropout (LDO) regulator with a split-supply architecture
• Manufacturer: Fairchild Semiconductor

© 2006 Fairchild Semiconductor Corporation
FAN2560 • Rev. 1.0.1
Physical Dimensions
Product Specific Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
F
FAN2560UC13X
FAN2560UC15X
BALL A1
INDEX AREA
2X
(Y)+/-.018
Product
D
0.05 C
0.03 C
0.433
C
0.50
BOTTOM VIEW
TOP VIEW
1 2
E
F
3
1.330 +/- 0.030
1.330 +/- 0.030
SEATING PLANE
0.50
C
B
A
Figure 26. Wafer-Level Chip-Scale Packaging (WLCSP)
(X)+/-.018
A
0.625 MAX
D
5 X Ø0.315 +/- .025
0.06 C
D
B
0.005
2X
F
SIDE VIEWS
F
E
0.03 C
C A B
0.960 +/- 0.030
0.960 +/- 0.030
0.332±0.018
E
(Ø0.25)
Cu PAD
10
C. DIMENSIONS AND TOLERANCES PER
E
H. DRAWING FILENAME: MKT-UC005AArev5
D
F
G. BALL COMPOSITION: Sn95.5Ag3.9Cu0.6
A. NO JEDEC REGISTRATION APPLIES
B. DIMENSIONS ARE IN MILLIMETERS.
RECOMMENDED LAND PATTERN (NSMD)
DATUM C, THE SEATING PLANE, IS DEFINED
BY THE SPHERICAL CROWNS OF THE BALLS.
PACKAGE TYPICAL HEIGHT IS 582 MICRONS
FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
SAC405 ALLOY
ASME Y14.5M, 1994
+/- 43 MICRONS (539-625 MICRONS)
(0.433)
A1
0.250±0.025
0.230
0.230
X
(0.50)
(0.866)
(Ø0.35)
SOLDER MASK
OPENING
0.232
0.232
Y
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