FSB117H Fairchild Semiconductor, FSB117H Datasheet - Page 5

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FSB117H

Manufacturer Part Number
FSB117H
Description
Manufacturer
Fairchild Semiconductor
Datasheet

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Manufacturer:
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© 2011 Fairchild Semiconductor Corporation
FSB117H / FSB127H / FSB147H • Rev. 1.0.4
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Notes:
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Thermal Resistance Table
Note:
5.
6.
7.
8.
9.
10. Internally limited by Over-Temperature Protection (OTP). Refer to T
11. Measured on the package top surface.
Symbol
Symbol
Symbol
V
T
ESD
V
E
V
V
R
V
DRAIN
I
ψ
θ
P
T
T
DM
STG
IPK
All voltage values, except differential voltages, are given with respect to the network ground terminal.
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.
Non-repetitive rating: pulse width is limited by maximum junction temperature.
L=51mH, starting T
L=14mH, starting T
AS
DD
FB
HV
HV
JA
D
JT
J
L
Drain Pin Voltage
Drain Current Pulsed
Single Pulsed Avalanche Energy
DC Supply Voltage
FB Pin Input Voltage
IPK Pin Input Voltage
HV Pin Input Voltage
Power Dissipation (T
Operating Junction Temperature
Storage Temperature Range
Lead Soldering Temperature (Wave Soldering or IR, 10 Seconds)
Electrostatic Discharge Capability,
All Pins Except HV Pin
Electrostatic Discharge Capability,
All Pins Including HV Pin
Resistor Connect to HV Pin for Full Range Input Detection
Junction-to-Air Thermal Resistance
Junction-to-Package Thermal Resistance
J
J
=25°C.
=25°C.
(5,6)
A
(7)
<50°C)
Parameter
Parameter
Parameter
(8)
FSB117H
FSB127H
FSB147H
FSB117H
FSB127H
FSB147H
Human Body Model:
JESD22-A114
Charged Device Model:
JESD22-C101
Human Body Model:
JESD22-A114
Charged Device Model:
JESD22-C101
(11)
5
(9)
OTP
.
Min.
Min.
5.50
2.00
3.00
1.25
-0.3
-0.3
150
-40
-55
Typ.
86
20
Limited
Internally
Max.
Max.
+150
+260
700
140
120
700
250
4.0
8.0
9.6
7.0
7.0
1.5
50
30
(10)
www.fairchildsemi.com
C/W
C/W
Unit
Unit
Unit
mJ
kΩ
C
C
C
kV
W
V
A
V
V
V
V

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