SAM3N2B Atmel Corporation, SAM3N2B Datasheet - Page 728

• Manufacturer Part Number: SAM3N2B
• Manufacturer: Atmel Corporation

Specifications of SAM3N2B

• Flash (kbytes): 128 Kbytes
• Pin Count: 64
• Max. Operating Frequency: 48 MHz
• Cpu: Cortex-M3
• # Of Touch Channels: 23
• Hardware Qtouch Acquisition: No
• Max I/o Pins: 47
• Ext Interrupts: 47
• Quadrature Decoder Channels: 2
• Usb Speed: No
• Usb Interface: No
• Spi: 3
• Twi (i2c): 2
• Uart: 4
• Ssc: 1
• Graphic Lcd: No
• Video Decoder: No
• Camera Interface: No
• Adc Channels: 10
• Adc Resolution (bits): 10
• Adc Speed (ksps): 384
• Resistive Touch Screen: No
• Dac Channels: 1
• Dac Resolution (bits): 10
• Temp. Sensor: No
• Crypto Engine: No
• Sram (kbytes): 16
• Self Program Memory: YES
• Dram Memory: No
• Nand Interface: No
• Picopower: No
• Temp. Range (deg C): -40 to 85
• I/o Supply Class: 1.8/3.3
• Operating Voltage (vcc): 1.62 to 3.6
• Fpu: No
• Mpu / Mmu: no / no
• Timers: 6
• Output Compare Channels: 6
• Input Capture Channels: 3
• Pwm Channels: 4
• 32khz Rtc: Yes
• Calibrated Rc Oscillator: Yes

36. Mechanical Characteristics
Figure 36-1. 100-lead LQFP Package Mechanical Drawing
Table 36-1.
Table 36-2.
Table 36-3.
This package respects the recommendations of the NEMI User Group.
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SAM3N4/2/1
JEDEC Drawing Reference
JESD97 Classification
Moisture Sensitivity Level
Note : 1. This drawing is for general information only. Refer to JEDEC Drawing MS-026 for additional information.
SAM3N
Device and LQFP Package Maximum Weight
Package Reference
LQFP Package Characteristics
MS-026
e3
800
3
mg
11011A–ATARM–04-Oct-10