SAM3N2B Atmel Corporation, SAM3N2B Datasheet - Page 497

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SAM3N2B

Manufacturer Part Number
SAM3N2B
Description
Manufacturer
Atmel Corporation
Datasheets

Specifications of SAM3N2B

Flash (kbytes)
128 Kbytes
Pin Count
64
Max. Operating Frequency
48 MHz
Cpu
Cortex-M3
# Of Touch Channels
23
Hardware Qtouch Acquisition
No
Max I/o Pins
47
Ext Interrupts
47
Quadrature Decoder Channels
2
Usb Speed
No
Usb Interface
No
Spi
3
Twi (i2c)
2
Uart
4
Ssc
1
Graphic Lcd
No
Video Decoder
No
Camera Interface
No
Adc Channels
10
Adc Resolution (bits)
10
Adc Speed (ksps)
384
Resistive Touch Screen
No
Dac Channels
1
Dac Resolution (bits)
10
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
16
Self Program Memory
YES
Dram Memory
No
Nand Interface
No
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
1.62 to 3.6
Fpu
No
Mpu / Mmu
no / no
Timers
6
Output Compare Channels
6
Input Capture Channels
3
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
Yes
28.11.5
Name:
Addresses: 0x40018010 (0), 0x4001C010 (1)
Access:
Reset:
TWI_CWGR is only used in Master mode.
• CLDIV: Clock Low Divider
The SCL low period is defined as follows:
• CHDIV: Clock High Divider
The SCL high period is defined as follows:
• CKDIV: Clock Divider
The CKDIV is used to increase both SCL high and low periods.
11011A–ATARM–04-Oct-10
11011A–ATARM–04-Oct-10
T
T
low
high
=
=
31
23
15
(
7
(
(
(
CLDIV
CHDIV
TWI Clock Waveform Generator Register
TWI_CWGR
Read-write
0x00000000
×
×
2
2
CKDIV
CKDIV
30
22
14
6
)
)
+
+
4 )
4 )
×
×
T
T
MCK
MCK
29
21
13
5
28
20
12
4
CHDIV
CLDIV
27
19
11
3
26
18
10
2
CKDIV
25
17
9
1
SAM3N
SAM3N
24
16
8
0
497
497

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