MT47H16M16FG-37E Micron Technology Inc, MT47H16M16FG-37E Datasheet - Page 107

• Manufacturer Part Number: MT47H16M16FG-37E
• Description: DRAM Chip DDR2 SDRAM 256M-Bit 16Mx16 1.8V 84-Pin FBGA Tray
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H16M16FG-37E

• Package: 84FBGA
• Density: 256 Mb
• Address Bus Width: 15 Bit
• Operating Supply Voltage: 1.8 V
• Maximum Clock Rate: 533 MHz
• Maximum Random Access Time: 0.5 ns
• Operating Temperature: 0 to 85 °C

Figure 64: WRITE – DM Operation
PDF: 09005aef8117c187
256MbDDR2.pdf - Rev. M 7/09 EN
DQS, DQS#
Bank select
Command
Address
CK#
CKE
A10
DQ 7
DM
CK
NOP 1
T0
Notes:
Bank x
ACT
RA
RA
T1
t CK
1. NOP commands are shown for ease of illustration; other commands may be valid at
2. BL = 4, AL = 1, and WL = 2 in the case shown.
3. Disable auto precharge.
4. “Don’t Care” if A10 is HIGH at T11.
5.
6. Subsequent rising DQS signals must align to the clock within
7. DI n = data-in for column n; subsequent elements are applied in the programmed order.
8.
9.
NOP 1
T2
these times.
t
t
t
t CH
WR starts at the end of the data burst regardless of the data mask condition.
DSH is applicable during
DSS is applicable during
t RCD
t CL
Bank x
WRITE 2
Col n
3
T3
AL = 1
NOP 1
T4
WL ± t DQSS (NOM)
WL = 2
NOP 1
t
T5
107
t
DQSS (MAX) and is referenced from CK T7 or T8.
DQSS (MIN) and is referenced from CK T6 or T7.
t WPRE
NOP 1
T6
DI
n
t RAS
Micron Technology, Inc. reserves the right to change products or specifications without notice.
T6n
t DQSL t DQSH t WPST
256Mb: x4, x8, x16 DDR2 SDRAM
NOP 1
6
T7
T7n
NOP 1
T8
Transitioning Data
NOP 1
T9
©2003 Micron Technology, Inc. All rights reserved.
t
DQSS.
t WR 5
T10
NOP 1
One bank
All banks
Don’t Care
Bank x 4
T11
PRE
WRITE
t RPA