TE28F160S375 Intel, TE28F160S375 Datasheet - Page 19

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TE28F160S375

Manufacturer Part Number
TE28F160S375
Description
Manufacturer
Intel
Datasheet

Specifications of TE28F160S375

Cell Type
NOR
Density
16Mb
Access Time (max)
75ns
Interface Type
Parallel
Boot Type
Not Required
Address Bus
21/20Bit
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Program/erase Volt (typ)
2.7/3.3/5V
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8/16Bit
Number Of Words
2M/1M
Supply Current
30mA
Mounting
Surface Mount
Pin Count
56
Lead Free Status / Rohs Status
Not Compliant
4.2.2
The Query command causes the flash component
to display the Common Flash Interface (CFI) Query
structure or “database.” The structure sub-sections
and address locations are summarized in Table 8.
The following sections describe the Query structure
sub-sections in detail.
NOTES:
1. Refer to Section 4.2.1 and Table 4 for the detailed definition of offset address as a function of device word width and mode.
2. BA = The beginning location of a Block Address (i.e., 08000h is the beginning location of block 1 when the block size is
3. Offset 15 defines “P” which points to the Primary Intel-specific Extended Query Table.
00h
01h
(BA+2)h
04-0Fh
10h
1Bh
27h
P
32 Kword).
ADVANCE INFORMATION
(3)
Offset
(2)
QUERY STRUCTURE OVERVIEW
Block Status Register
Reserved
CFI Query Identification String
System Interface Information
Device Geometry Definition
Primary Intel-Specific Extended Query
Table
Sub-Section Name
Table 6. Query Structure
Manufacturer Code
Device Code
Block-specific information
Reserved for vendor-specific information
Command set ID and vendor data offset
Device timing & voltage information
Flash device layout
Vendor-defined additional information
specific to the Primary Vendor Algorithm
(1)
Description
28F160S3, 28F320S3
19

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