DSP56002FC66 Freescale Semiconductor, DSP56002FC66 Datasheet - Page 91

• Manufacturer Part Number: DSP56002FC66
• Manufacturer: Freescale Semiconductor

Specifications of DSP56002FC66

• Device Core Size: 24b
• Architecture: Harvard
• Format: Fixed Point
• Clock Freq (max): 66MHz
• Mips: 33
• Device Input Clock Speed: 66MHz
• Ram Size: 3KB
• Program Memory Size: 1.5KB
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (min): 4.5V
• Operating Supply Voltage (max): 5.5V
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 132
• Package Type: PQFP
• Lead Free Status / Rohs Status: Supplier Unconfirmed

PGA Package Description
MOTOROLA
Note:
M
G
C
D
H
N
A
B
E
F
K
L
J
GND
GND
GND
GND
GND
GND
GND
V
V
V
D15
D14
D11
Figure 3-7 Top View of the 132-pin Ceramic (RC) 13 13 Pin Grid Array Package
CCD
CCD
CCD
1. “NC” are No Connection pins that are reserved for possible future enhancements. Do not
2. An OVERBAR indicates the signal is asserted when the voltage = ground (active low).
1
Q
D
D
D
D
D
D
Top and bottom views of the PGA package are shown in Figure 3-7 and Figure 3-8
with their pin-outs.
connect these pins to any power, ground, signal traces, or vias.
MODB/
V
V
IRQB
D20
D18
D16
D13
D10
CCCK
D8
D6
D4
D2
D0
CCQ
2
RESET
MODA/
Orientation
GND
GND
IRQA
D21
D19
D17
D12
D9
D7
D5
D3
D1
Freescale Semiconductor, Inc.
3
Mark
Q
A
For More Information On This Product,
GND
V
V
CKP
D23
D22
A15
A14
A13
A12
CCQ
CCA
4
CK
Go to: www.freescale.com
CKOUT
MODC/
GND
GND
V
NMI
A11
A10
A9
CCP
5
DSP56002/D, Rev. 3
Q
A
GND
PCAP
GND
V
A8
A7
CCQ
6
P
A
Top View
PLOCK
GND
PINIT
V
A6
A5
CCA
7
Q
EXTAL
GND
V
XTAL
A3
A4
CCQ
8
A
HR/W
V
HA2
HA1
HA0
A0
A1
A2
CCA
9
Pin-out and Package Information
HREQ
HACK
GND
HEN
X/Y
10
RD
H4
H3
DS
PS
A
DSI/OS0
DSO
SC0
STD
TIO
WR
11
DR
BS
H6
H7
H2
H1
H0
DSCK/
GND
SCLK
RXD
TXD
SCK
OS1
SC1
WT
12
NC
BG
BR
NC
H5
H
Packaging
GNDS
GNDS
GNDC
GND
GND
GND
V
V
V
V
SRD
SC2
13
BN
CCH
CCH
CCS
CCC
AA0615
3-23
H
H
H