MC68EC040RC25 Freescale Semiconductor, MC68EC040RC25 Datasheet - Page 11

• Manufacturer Part Number: MC68EC040RC25
• Manufacturer: Freescale Semiconductor

Specifications of MC68EC040RC25

• Family Name: M68000
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 25MHz
• Instruction Set Architecture: RISC
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Through Hole
• Pin Count: 179
• Package Type: PGA
• Lead Free Status / Rohs Status: Supplier Unconfirmed

Paragraph
9.7.5
9.7.5.1
9.7.5.2
9.7.6
9.7.7
9.8
10.1
10.2
10.3
10.4
10.5
10.6
10.7
10.7.1
10.7.2
10.7.3
11.1
11.2
11.3
11.4
11.5
11.6
11.7
11.8
11.8.1
11.8.2
11.9
11.9.1
11.9.2
11.9.3
11.9.4
MOTOROLA
Number
Floating-Point State Frames.................................................................. 9-39
CINV and CPUSH Instruction Timing.................................................... 10-8
MOVE Instruction Timing ...................................................................... 10-9
Floating-Point Unit Instruction Timings ................................................. 10-29
Overview ............................................................................................... 10-3
Instruction Timing Examples ................................................................. 10-5
Miscellaneous Integer Unit Instruction Timings..................................... 10-11
Integer Unit Instruction Timings ............................................................ 10-13
Maximum Ratings ................................................................................. 11-1
Thermal Characteristics ........................................................................ 11-1
DC Electrical Specifications .................................................................. 11-2
Power Dissipation ................................................................................. 11-2
Clock AC Timing Specifications ............................................................ 11-3
Output AC Timing Specifications .......................................................... 11-4
Input AC Timing Specifications ............................................................. 11-5
MC68040 Thermal Device Characteristics............................................ 11-12
MC68040 Thermal Management Techniques ....................................... 11-14
Underflow .......................................................................................... 9-33
Divide by Zero.................................................................................... 9-36
Inexact Result .................................................................................... 9-36
Miscellaneous Integer Unit Support Timings ..................................... 10-29
Integer Unit Support Timings ............................................................. 10-30
Timings in the Floating-Point Unit ...................................................... 10-35
MC68040 Die and Package ............................................................... 11-12
MC68040 Power Considerations ....................................................... 11-12
Still Air................................................................................................ 11-17
Forced Air .......................................................................................... 11-18
With Heat Sink ................................................................................... 11-19
With Heat Sink and Forced Air .......................................................... 11-22
TABLE OF CONTENTS (Continued)
Maskable Exception Conditions ..................................................... 9-34
Nonmaskable Exception Conditions .............................................. 9-34
MC68040 Electrical and Thermal Characteristics
Freescale Semiconductor, Inc.
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M68040 USER’S MANUAL
Instruction Timings
Section 10
Section 11
Title
Number
Page
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