VSC8641XKO Vitesse Semiconductor Corp, VSC8641XKO Datasheet - Page 114

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VSC8641XKO

Manufacturer Part Number
VSC8641XKO
Description
IC PHY 10/100/1000 100-LQFP
Manufacturer
Vitesse Semiconductor Corp
Type
PHY Transceiverr
Datasheets

Specifications of VSC8641XKO

Number Of Drivers/receivers
1/1
Protocol
Gigabit Ethernet
Voltage - Supply
2.5V, 3.3V
Mounting Type
Surface Mount
Package / Case
100-LQFP
Case
TQFP
Dc
07+
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
907-1031

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7
7.1
Revision 4.3
August 2009
Package Information
The VSC8641 device is available in two package types. VSC8641XJF is a lead(Pb)-free,
88-pin, plastic quad flat no-lead (QFN) package with an exposed pad, 10 mm × 10 mm
body size, 0.4 mm pin pitch, and 0.9 mm maximum height. VSC8641XKO and
VSC8641XKO-03 are packaged in a 100-pin, plastic low-profile quad flat package
(LQFP) with an exposed pad, 12 mm × 12 mm body size, 1.4 mm body thickness,
0.4 mm pin pitch, and 1.6 mm maximum height.
Lead(Pb)-free products from Vitesse comply with the temperatures and profiles defined
in the joint IPC and JEDEC standard IPC/JEDEC J-STD-020. For more information, see
the IPC and JEDEC standard.
This section provides the package drawings, thermal specifications, and moisture
sensitivity ratings for the devices.
Package Drawings
The following illustrations show the package drawings for the devices. The drawings
contain the top view, bottom view, side view, detail views, dimensions, tolerances, and
notes.
Package Information
VSC8641 Datasheet
Page 114

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