PIC24FJ64GA002-I/SO Microchip Technology Inc., PIC24FJ64GA002-I/SO Datasheet - Page 244

• Manufacturer Part Number: PIC24FJ64GA002-I/SO
• Description: MCU, 16-Bit, 28-Pin, 64KB Flash, 8KB RAM, 21 I/O, Nanowatt
• Manufacturer: Microchip Technology Inc.

Specifications of PIC24FJ64GA002-I/SO

• A/d Inputs: 10 Channel, 10-Bit
• Comparators: 2
• Cpu Speed: 16 MIPS
• Eeprom Memory: 0 Bytes
• Input Output: 21
• Interface: I2C/SPI/UART
• Memory Capacity: 64 Kbytes
• Memory Type: Flash
• Number Of Bits: 16
• Number Of Inputs: 21
• Number Of Pins: 28
• Package Type: 28-pin SOIC
• Programmable Memory: 64K Bytes
• Ram Size: 8K Bytes
• Speed: 32 MHz
• Timers: 5-16-bit
• Voltage, Range: 2-3.6 V
• Voltage, Rating: 2-3.6 V
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

PIC24FJ64GA004 FAMILY
DS39881B-page 242
28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN]
with 0.55 mm Contact Length
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
Dimension Limits
1
2
A1
EXPOSED
E
Preliminary
A
NOTE 1
PAD
Units
A1
A3
E2
D2
N
A
E
D
K
e
b
L
E2
2
1
MIN
0.80
0.00
3.65
3.65
0.23
0.50
0.20
N
MILLIMETERS
BOTTOM VIEW
0.65 BSC
6.00 BSC
6.00 BSC
0.20 REF
NOM
0.90
0.02
3.70
3.70
0.30
0.55
28
D2
–
Microchip Technology Drawing C04-105B
© 2007 Microchip Technology Inc.
MAX
1.00
0.05
4.20
4.20
0.35
0.70
–
L
b
K
e