TDA8026ET/C2,518 NXP Semiconductors, TDA8026ET/C2,518 Datasheet - Page 39
![no-image](/images/manufacturer_photos/0/4/487/nxp_semiconductors_sml.jpg)
TDA8026ET/C2,518
Manufacturer Part Number
TDA8026ET/C2,518
Description
IC SMART CARD SLOT 64TFBGA
Manufacturer
NXP Semiconductors
Datasheet
1.TDA8026ETC2518.pdf
(59 pages)
Specifications of TDA8026ET/C2,518
Controller Type
Smart Card Interface
Interface
I²C
Voltage - Supply
2.7 V ~ 5.5 V
Current - Supply
210mA
Operating Temperature
-25°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
64-TFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TDA8026ET/C2,518
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
9. Limiting values
10. Thermal characteristics
TDA8026_1
Product data sheet
Table 40.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
Table 41.
[1]
Symbol
V
V
V
V
P
T
V
Symbol
R
stg
DD
DD(INTF)
IH
o
tot
ESD
th(j-a)
The limiting values depend on the external inductor and V
Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the
remaining. Method 3015 (HBM; 1500 ; 100 pF) defines three pulses positive and three pulses negative on
each pin referenced to ground.
The 7 kV ESD test is performed in the typical application configuration as depicted in the Application note
AN10724 with two external capacitors connected to each V
With a 4-layer board
Parameter
supply voltage
interface supply
voltage
HIGH-level input
voltage
output voltage
total power
dissipation
storage
temperature
electrostatic
discharge voltage
Parameter
thermal resistance from junction to ambient
Limiting values
Thermal characteristics
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 9 March 2010
Conditions
on pin V
on pin V
on all card pins
on all other pins
on pin LX
DC-to-DC converter output on pin
V
T
HBM
MM
CDM
amb
UP
on I/O
PRES, RST
pins
on all other pins
on all pins
on all pins
= 25 C to +85 C
DD
DD(INTF)
(n)
, V
CC(n)
(n)
, C4
, CLK
(1)
, C8
UP
(n)
Multiple smart card slot interface IC
CC(n)
, GNDC
Conditions
decoupling capacitor used.
(1)
line.
card
(n)
,
[1]
[1]
[2]
[3]
Min
-
0.5
0.5
0.5
0.5
0.5
0.5
55
7
2
200
500
TDA8026
© NXP B.V. 2010. All rights reserved.
[1]
Max
+6
+4.6
+6
+4.6
+7.2
+7.2
665
+150
+7
+2
+200
+500
Typ
47.1
Unit
K/W
39 of 59
Unit
V
V
V
V
V
V
mW
kV
kV
V
V
C