TDA8026ET/C2,518 NXP Semiconductors, TDA8026ET/C2,518 Datasheet - Page 3

• Manufacturer Part Number: TDA8026ET/C2,518
• Description: IC SMART CARD SLOT 64TFBGA
• Manufacturer: NXP Semiconductors

Specifications of TDA8026ET/C2,518

• Controller Type: Smart Card Interface
• Interface: I²C
• Voltage - Supply: 2.7 V ~ 5.5 V
• Current - Supply: 210mA
• Operating Temperature: -25°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 64-TFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
Table 1.
V
T
[1]
[2]
[3]
[4]
[5]
[6]
5. Ordering information
Table 2.
TDA8026_1
Product data sheet
Symbol
Card supply voltage pins: V
V
V
I
General
t
t
P
T
Type number
TDA8026ET/C2
CC
deact
deb
amb
DD
amb
CC
ripple(p-p)
tot
= V
Refer to
Typical value measurement based on a 85 % DC-to-DC converter and inductance efficiency; depends on PCB layout and external
component quality (inductor, capacitor).
Maximum value measurement based on a 125 mA (sum of all card supply currents on pins V
converter and inductance efficiency; depends on PCB layout and external component quality (inductor, capacitor).
Two ceramic multilayer 100 nF (minimum) capacitors with a low Equivalent Series Resistance (ESR) should be used to meet these
specifications.
Output voltage to the card including ripple.
Refer to
= 25 C unless otherwise specified.
DD(INTF)
Quick reference data
Ordering information
Section 8.6
Section 8.8.3
Parameter
supply voltage
peak-to-peak ripple
voltage
supply current
deactivation time
debounce time
total power dissipation
ambient temperature
= 3.3 V; f
Package
Name
TFBGA64
for further information about the DC-to-DC converter operation.
for further information.
clk(ext)
CC(1)
= 10 MHz; GND = 0 V; inductor = 10 H; decoupling capacitors on pins V
…continued
to V
Description
plastic thin fine-pitch ball grid array package; 64 balls
Conditions
active mode; 2.7 V < V
active mode; AC current pulses with
I < 200 mA, t < 400 ns and f < 20 MHz
20 kHz to 200 MHz with default Register6
(Slew Rate register) settings
V
V
V
sum of all card supply currents on pins
V
f
I
I
total sequence
T
clk(ext)
CC(1)
CC(3)
CC(5)
amb
CC(n)
CC(n)
CC(n)
CC(n)
5 V card; DC I
3 V card; DC I
1.8 V card; DC I
5 V card; current spikes of 40 nAs
3 V card; current spikes of 17.5 nAs
1.8 V card; current spikes of 11.1 nAs
All information provided in this document is subject to legal disclaimers.
= 25 C to +85 C
= I
= I
[4]
; active mode; All V
= 5 V
= 3 V
= 1.8 V
on pins CLK
CC(2)
CC(4)
Rev. 1 — 9 March 2010
= 55 mA;
= I
CC(5)
CC(n)
CC(n)
CC(n)
(n)
= 2 mA
= 5 MHz;
DD
55 mA
55 mA
CC
35 mA
< 5.5 V
pins = 5 V;
Multiple smart card slot interface IC
[5]
[5]
[3]
[6]
CC(n)
Min
4.75
2.85
1.71
4.65
2.76
1.62
-
-
-
-
-
60
-
-
25
) current load and a 75 % DC-to-DC
Typ
5
3
1.8
-
-
-
-
-
-
-
80
17.8
455
+25
116 125
TDA8026
DD
© NXP B.V. 2010. All rights reserved.
Version
SOT1073-1
and V
Max
5.25
3.15
1.89
5.35
3.24
1.98
350
55
55
35
100
23.8
665
+85
UP
= 10 F;
Unit
V
V
V
V
V
V
mV
mA
mA
mA
mA
ms
mW
C
s
3 of 59