GC80503CSM66166SL388 Intel, GC80503CSM66166SL388 Datasheet - Page 40

• Manufacturer Part Number: GC80503CSM66166SL388
• Description: IC MPU 1.9V PENTI 166MHZ 352BGA
• Manufacturer: Intel

Specifications of GC80503CSM66166SL388

• Rohs Status: RoHS non-compliant
• Processor Type: Pentium I w/MMX
• Features: 66MHz Bus
• Speed: 166MHz
• Voltage: 1.9V
• Mounting Type: Surface Mount
• Package / Case: 352-BGA
• Other names: 821225

Low-Power Embedded Pentium
3.12.4
40
Table 15. Thermal Resistances for PPGA Packages
Figure 11. Thermal Resistance vs. Heatsink Height, PPGA Packages
PPGA Package Thermal Resistance Information
Table 15 lists the
technology in the PPGA package with passive heatsinks.
NOTES:
Heatsink Height
1. Heatsinks are omni-directional pin aluminum alloy.
2. Features were based on standard extrusion practices for a given height: pin size ranged from 50 to 129
3. Heatsink attach was 0.005" of thermal grease. Attach thickness of 0.002" will improve performance by
mils; pin spacing ranged from 93 to 175 mils; base thickness ranged from 79 to 200 mils.
approximately 0.3 watt.
(inches)
None
0.25
0.35
0.45
0.55
0.65
0.80
1.00
1.20
1.40
10
9
8
7
6
5
4
3
2
1
0
0.2
JC
(°C/watt)
®
and
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
1.3
Processor with MMX™ Technology
JC
0.4
CA
values for the low-power embedded Pentium processor with MMX
12.9
8.9
8.6
8.2
7.9
7.5
6.8
6.1
5.7
5.2
0
0.6
Heatsink Height (inches)
CA
12.2
100
7.8
7.3
6.8
6.3
5.8
5.1
4.5
4.1
3.7
(°C/watt) vs. Laminar Airflow (linear ft/min)
0.8
11.2
200
6.4
5.8
5.1
4.5
4.1
3.7
3.4
3.1
2.8
1.0
400
4.3
3.8
3.4
3.0
2.8
2.6
2.4
2.2
2.0
7.7
Airflow Rate (LFM)
0
100
200
1.2
600
3.4
3.1
2.7
2.4
2.2
2.0
1.9
1.8
1.7
6.3
Datasheet
400
600
800
800
2.8
2.6
2.3
2.1
1.9
1.8
1.6
1.6
1.5
5.4
1.4