GC80503CSM66166SL388 Intel, GC80503CSM66166SL388 Datasheet - Page 4

• Manufacturer Part Number: GC80503CSM66166SL388
• Description: IC MPU 1.9V PENTI 166MHZ 352BGA
• Manufacturer: Intel

Specifications of GC80503CSM66166SL388

• Rohs Status: RoHS non-compliant
• Processor Type: Pentium I w/MMX
• Features: 66MHz Bus
• Speed: 166MHz
• Voltage: 1.9V
• Mounting Type: Surface Mount
• Package / Case: 352-BGA
• Other names: 821225

Low-Power Embedded Pentium
Figures
4
4.6
4.7
4.8
1
2
3
4
5
6
7
8
9
10
11
12
13
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4.5.2
4.5.3
4.5.4
4.5.5
Measuring Maximum Overshoot, Undershoot and Ringback.............................. 63
Measuring Overshoot Threshold Duration .......................................................... 63
Measuring Undershoot Threshold Duration ........................................................ 63
Pentium
PPGA Package Top Side View ........................................................................... 15
PPGA Package Pin Side View ............................................................................ 16
HL-PBGA Package Top Side View ..................................................................... 19
HL-PBGA Package Pin Side View ...................................................................... 20
EAX Bit Assignments for CPUID......................................................................... 30
EDX Bit Assignments for CPUID......................................................................... 30
PPGA Package Dimensions ............................................................................... 36
HL-PBGA Package Dimensions.......................................................................... 38
Technique for Measuring T
Thermal Resistance vs. Heatsink Height, PPGA Packages ............................... 41
Thermal Resistance vs. Airflow for HL-PBGA Package...................................... 42
Clock Waveform.................................................................................................. 52
Valid Delay Timings ............................................................................................ 52
Float Delay Timings ............................................................................................ 52
Setup and Hold Timings...................................................................................... 53
Reset and Configuration Timings........................................................................ 53
Test Timings........................................................................................................ 54
Test Reset Timings ............................................................................................. 54
First Order Input Buffer Model............................................................................. 55
First Order Output Buffer Model.......................................................................... 56
Maximum Overshoot Level, Overshoot Threshold Level and
Overshoot Threshold Duration ............................................................................ 59
Maximum Undershoot Level, Undershoot Threshold Level
and Undershoot Threshold Duration ................................................................... 60
Maximum Ringback Associated with the Signal High State................................ 61
Maximum Ringback Associated with the Signal Low State................................. 61
Settling Time ....................................................................................................... 62
Undershoot............................................................................................. 59
Ringback ................................................................................................ 60
Settling Time .......................................................................................... 61
Measurement Methodology.................................................................... 62
®
Processor with MMX™ Technology Block Diagram............................ 11
®
Processor with MMX™ Technology
C
............................................................................... 40
Datasheet