GC80503CSM66166SL388 Intel, GC80503CSM66166SL388 Datasheet - Page 3

• Manufacturer Part Number: GC80503CSM66166SL388
• Description: IC MPU 1.9V PENTI 166MHZ 352BGA
• Manufacturer: Intel

Specifications of GC80503CSM66166SL388

• Rohs Status: RoHS non-compliant
• Processor Type: Pentium I w/MMX
• Features: 66MHz Bus
• Speed: 166MHz
• Voltage: 1.9V
• Mounting Type: Surface Mount
• Package / Case: 352-BGA
• Other names: 821225

Contents
1.0
2.0
3.0
4.0
Datasheet
Introduction
1.1
Architecture Overview
2.1
2.2
2.3
Packaging Information
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
3.12
Electrical Specifications
4.1
4.2
4.3
4.4
4.5
Processor Features ............................................................................................... 7
Pentium
Pentium
2.2.1
2.2.2
2.2.3
2.2.4
2.2.5
0.25 Micron Technology ......................................................................................13
Differences from Desktop Processors.................................................................14
PPGA Pinout and Pin Descriptions .....................................................................15
HL-PBGA Pinout and Pin Descriptions ...............................................................19
Design Notes.......................................................................................................23
Pin Quick Reference ...........................................................................................23
Bus Fraction (BF) Selection ................................................................................29
The CPUID Instruction ........................................................................................30
Boundary Scan Chain List...................................................................................32
Pin Reference Tables..........................................................................................33
Pin Grouping According to Function....................................................................35
Mechanical Specifications ...................................................................................36
3.11.1 PPGA Package Mechanical Diagrams...................................................36
3.11.2 HL-PBGA Package Mechanical Diagrams .............................................38
Thermal Specifications ........................................................................................39
3.12.1 Measuring Thermal Values ....................................................................39
3.12.2 Thermal Equations and Data..................................................................39
3.12.3 Airflow Calculations for Maximum and Typical Power............................40
3.12.4 PPGA Package Thermal Resistance Information ..................................41
3.12.5 HL-PBGA Package Thermal Resistance Information.............................42
Absolute Maximum Ratings.................................................................................43
DC Specifications ................................................................................................43
4.2.1
AC Specifications ................................................................................................46
4.3.1
4.3.2
4.3.3
4.3.4
I/O Buffer Models ................................................................................................55
4.4.1
Signal Quality Specifications ...............................................................................58
4.5.1
Low-Power Embedded Pentium
.................................................................................................................. 7
Full Support for Intel MMX™ Technology ..............................................12
16-Kbyte Code and Data Caches...........................................................13
Improved Branch Prediction ...................................................................13
Enhanced Pipeline .................................................................................13
Deeper Write Buffers..............................................................................13
Power Sequencing .................................................................................43
Power and Ground .................................................................................46
Decoupling Recommendations ..............................................................46
Connection Specifications ......................................................................47
AC Timings.............................................................................................47
Buffer Model Parameters .......................................................................56
Overshoot...............................................................................................58
®
®
Processor Family Architecture .............................................................. 9
Processor with MMX™ Technology ....................................................12
............................................................................................. 8
...........................................................................................14
........................................................................................43
®
Processor with MMX™ Technology
3