EP3C5F256I7N Altera, EP3C5F256I7N Datasheet - Page 116
![IC CYCLONE III FPGA 5K 256 FBGA](/photos/6/70/67063/544-256-fbga_sml.jpg)
EP3C5F256I7N
Manufacturer Part Number
EP3C5F256I7N
Description
IC CYCLONE III FPGA 5K 256 FBGA
Manufacturer
Altera
Series
Cyclone® IIIr
Datasheets
1.EP3C5F256C8N.pdf
(5 pages)
2.EP3C5F256C8N.pdf
(34 pages)
3.EP3C5F256C8N.pdf
(66 pages)
4.EP3C5F256C8N.pdf
(14 pages)
5.EP3C5F256C8N.pdf
(76 pages)
6.EP3C5F256I7N.pdf
(274 pages)
Specifications of EP3C5F256I7N
Number Of Logic Elements/cells
5136
Number Of Labs/clbs
321
Total Ram Bits
423936
Number Of I /o
182
Voltage - Supply
1.15 V ~ 1.25 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
256-FBGA
Family Name
Cyclone III
Number Of Logic Blocks/elements
5136
# I/os (max)
182
Frequency (max)
437.5MHz
Process Technology
65nm
Operating Supply Voltage (typ)
1.2V
Logic Cells
5136
Ram Bits
423936
Operating Supply Voltage (min)
1.15V
Operating Supply Voltage (max)
1.25V
Operating Temp Range
-40C to 100C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
256
Package Type
FBGA
For Use With
544-2601 - KIT DEV CYCLONE III LS EP3CLS200544-2411 - KIT DEV NIOS II CYCLONE III ED.
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Compliant
Other names
544-2558
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
EP3C5F256I7N
Manufacturer:
ALTERA32
Quantity:
1 608
Part Number:
EP3C5F256I7N
Manufacturer:
ALTERA/阿尔特拉
Quantity:
20 000
6–16
I/O Banks
Figure 6–10. Cyclone III Device Family I/O Banks
Notes to
(1) This is a top view of the silicon die. This is only a graphical representation. For exact pin locations, refer to the pin list and the Quartus II software.
(2) True differential (PPDS, LVDS, mini-LVDS, and RSDS I/O standards) outputs are supported in row I/O banks 1, 2, 5, and 6 only. External resistors
(3) The LVPECL I/O standard is only supported on clock input pins. This I/O standard is not supported on output pins.
(4) The HSTL-12 Class II is supported in column I/O banks 3, 4, 7, and 8 only.
(5) The differential SSTL-18 and SSTL-2, differential HSTL-18, and HSTL-15 I/O standards are supported only on clock input pins and phase-locked
(6) The differential HSTL-12 I/O standard is only supported on clock input pins and PLL output clock pins. Differential HSTL-12 Class II is supported
(7) BLVDS output uses two single-ended outputs with the second output programmed as inverted. BLVDS input uses the LVDS input buffer.
Cyclone III Device Handbook, Volume 1
are needed for the differential outputs in column I/O banks.
loops (PLLs) output clock pins. Differential SSTL-18, differential HSTL-18, and HSTL-15 I/O standards do not support Class II output.
only in column I/O banks 3, 4, 7, and 8.
Figure
f
6–10:
For information about the Cyclone III device family differential PPDS, LVDS,
mini LVDS, RSDS I/O, and Bus LVDS (BLVDS) standard termination, refer to the
High-Speed Differential Interfaces in Cyclone III Devices
I/O pins on the Cyclone III device family are grouped together into I/O banks, and
each bank has a separate power bus. Cyclone III and Cyclone III LS devices have eight
I/O banks, as shown in
bank. All single-ended I/O standards are supported in all banks except HSTL-12
Class II, which is only supported in column I/O banks. All differential I/O standards
are supported in all banks. The only exception is HSTL-12 Class II, which is only
supported in column I/O banks.
I/O Bank 8
I/O Bank 3
(Note
Figure
All I/O Banks Support:
3.3-V LVTTL/LVCMOS
3.0-V LVTTL/LVCMOS
2.5-V LVTTL/LVCMOS
1.8-V LVTTL/LVCMOS
1.5-V LVCMOS
1.2-V LVCMOS
PPDS
LVDS
RSDS
mini-LVDS
Bus LVDS ( 7)
LVPECL (3)
SSTL-2 class I and II
SSTL-18 CLass I and II
HSTL-18 Class I and II
HSTL-15 Class I and II
HSTL-12 Class I and II (4)
Differential SSTL-2 (5)
Differential SSTL-18 (5)
Differential HSTL-18 (5)
Differential HSTL-15 (5)
Differential HSTL-12 (6)
1),
6–10. Each device I/O pin is associated with one I/O
(2)
I/O Bank 4
I/O Bank 7
Chapter 6: I/O Features in the Cyclone III Device Family
chapter.
© December 2009 Altera Corporation
I/O Banks