EP2SGX60EF1152I4 Altera, EP2SGX60EF1152I4 Datasheet - Page 3

IC STRATIX II GX 60K 1152-FBGA

EP2SGX60EF1152I4

Manufacturer Part Number
EP2SGX60EF1152I4
Description
IC STRATIX II GX 60K 1152-FBGA
Manufacturer
Altera
Series
Stratix® II GXr
Datasheet

Specifications of EP2SGX60EF1152I4

Number Of Logic Elements/cells
60440
Number Of Labs/clbs
3022
Total Ram Bits
2544192
Number Of I /o
534
Voltage - Supply
1.15 V ~ 1.25 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
1152-FBGA
Family Name
Stratix II GX
Number Of Logic Blocks/elements
60440
# I/os (max)
534
Frequency (max)
732.1MHz
Process Technology
SRAM
Operating Supply Voltage (typ)
1.2V
Logic Cells
60440
Ram Bits
2544192
Operating Supply Voltage (min)
1.15V
Operating Supply Voltage (max)
1.25V
Operating Temp Range
-40C to 100C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
1152
Package Type
FC-FBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Not Compliant
Other names
544-2186

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Features
Altera Corporation
October 2007
SIIGX51001-1.6
The Stratix
to combine high-speed serial transceivers with a scalable,
high-performance logic array. Stratix II GX devices include 4 to 20
high-speed transceiver channels, each incorporating clock and data
recovery unit (CRU) technology and embedded SERDES capability at
data rates of up to 6.375 gigabits per second (Gbps). The transceivers are
grouped into four-channel transceiver blocks and are designed for low
power consumption and small die size. The Stratix II GX FPGA
technology is built upon the Stratix II architecture and offers a 1.2-V logic
array with unmatched performance, flexibility, and time-to-market
capabilities. This scalable, high-performance architecture makes
Stratix II GX devices ideal for high-speed backplane interface,
chip-to-chip, and communications protocol-bridging applications.
This section lists the Stratix II GX device features.
Main device features:
TriMatrix memory consisting of three RAM block sizes to
implement true dual-port memory and first-in first-out (FIFO)
buffers with performance up to 550 MHz
Up to 16 global clock networks with up to 32 regional clock
networks per device region
High-speed DSP blocks provide dedicated implementation of
multipliers (at up to 450 MHz), multiply-accumulate functions,
and finite impulse response (FIR) filters
Up to four enhanced PLLs per device provide spread spectrum,
programmable bandwidth, clock switch-over, real-time PLL
reconfiguration, and advanced multiplication and phase
shifting
Support for numerous single-ended and differential I/O
standards
High-speed source-synchronous differential I/O support on up
to 71 channels
Support for source-synchronous bus standards, including SPI-4
Phase 2 (POS-PHY Level 4), SFI-4.1, XSBI, UTOPIA IV, NPSI,
and CSIX-L1
Support for high-speed external memory, including quad data
rate (QDR and QDRII) SRAM, double data rate (DDR and
DDR2) SDRAM, and single data rate (SDR) SDRAM
®
II GX family of devices is Altera’s third generation of FPGAs
1. Introduction
1–1

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