1586026-5 TE Connectivity, 1586026-5 Datasheet - Page 9

• Manufacturer Part Number: 1586026-5
• Description: RECEPTACLE HOUSING, 5WAY
• Manufacturer: TE Connectivity
• Series: VAL-U-LOKr

Specifications of 1586026-5

• Pitch Spacing: 4.2mm
• No. Of Contacts: 5
• No. Of Rows: 1
• Connector Mounting: Free
• Gender: Receptacle
• Contact Material: Brass
• Contact Plating: Tin
• Colour: Clear
• Rohs Compliant: Yes
• Product Type: Connector
• Connector Type: Housing
• Termination Method To Wire/cable: Crimp
• Sealed: No
• Ul File Number: E28476
• Csa File Number: 208567
• Mating Retention Type: Latching
• Contact Current Rating, Max (a): 9
• Operating Voltage Reference: AC
• Operating Voltage (vac): 600
• Profile Height (y-axis) (mm [in]): 7.50 [0.295]
• Number Of Positions: 5
• Number Of Rows: 1
• Centerline (mm [in]): 4.20 [0.165]
• Mating Retention: With
• Selectively Loaded: No
• Length (x-axis) (mm [in]): 22.20 [0.874]
• Width (z-axis) (mm [in]): 19.80 [0.779]
• Contact Type: Socket
• Contact Design: Dual Beam
• Connector Style: Receptacle
• Mating Alignment: With
• Mating Alignment Type: Keyed
• Housing Color: Natural
• Ul Flammability Rating: UL 94V-2
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Not relevant for lead free process
• Rohs/elv Compliance History: Always was RoHS compliant
• Agency/standard: UL, CSA
• Ul Rating: Recognized
• Circuit Identification Feature: With
• Operating Temperature (°c [°f]): -40 – +105 [-40 – +221]
• Applies To: Wire/Cable
• Application Use: Wire-to-Board, Wire-to-Board / Wire-to-Wire, Wire-to-Wire
• Contact Transmits (typical Application): Signal (Data)
• Pick And Place Cover: Without
• Packaging Method: Bag

3.12. PC Board Solder Tine Holes
The holes in the pc board for the solder tines must be drilled and plated through to specific dimensions. See
Figure 10.
3.13. PC Board Header Assembly Placement
3.14. Soldering
Rev K
CAUTION
NOTE
Type RMA (Mildly Activated)
A. Manual Placement
Align the header assembly solder tines with the appropriate holes in the pc board. Start all solder tines into
the board, then press on the header until it seats on the pc board.
B. Robotic Placement
The robotic equipment must be adjusted to feed, pick up, and place the headers on the pc board with an
accuracy of 0.25 mm. The header assembly datum surfaces detailed on the customer drawing will ensure
correct placement of the header. For information on robotic equipment, see Section 5, TOOLING.
A. Flux Selection
Contact solder tines must be fluxed prior to soldering with a mildly active, rosin base flux. Selection of the
flux will depend on the type of pc board and other components mounted on the board. Additionally, the flux
must be compatible with the wave solder line, manufacturing, health, and safety requirements. Call the
Product Information phone number at the bottom of page 1 for consideration of other types of flux. Some
fluxes that are compatible with these header assemblies are provided in Figure 11.
B. Soldering Guidelines
VAL--U--LOK Series Header Assemblies can be soldered using a variety of soldering techniques. The
temperatures and exposure time shall be within the ranges specified in Figure 12. We recommend using
SN60 or SN62 solder for these header assemblies.
!
i
FLUX TYPE
FLUX TYPE
The header assemblies should be handled only by the housing to prevent deformation or other damage to the solder
tines.
Manual 402- - 40 provides some guidelines for establishing soldering practices. Refer to Paragraph 2.4, Manuals.
KESTER AND ALPHA are trademarks of their respective owners.
Dia of Finished Hole After
Plating (Vertical 1.28 +0.1)
(Right- - Angle 1.8 +0.1)
Board Thickness
1.78 Max
Tin/Lead Plated
(As Required)
(As Required)
Drilled Hole Diameter
ACTIVITY
ACTIVITY
Mild
Figure 10
Figure 11
Noncorrosive
RESIDUE
RESIDUE
KESTER
Pad Diameter
(As Required)
COMMERCIAL DESIGNATION
Copper Plating
(As Required)
(Maximum Hardness
of Copper to be 150
Knoop)
186
ALPHA
611
114- 13172
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