MT47H64M16HR-3 IT:HTR Micron Technology Inc, MT47H64M16HR-3 IT:HTR Datasheet - Page 4

• Manufacturer Part Number: MT47H64M16HR-3 IT:HTR
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H64M16HR-3 IT:HTR

• Organization: 64Mx16
• Density: 1Gb
• Address Bus: 16b
• Access Time (max): 450ps
• Maximum Clock Rate: 667MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 135mA
• Pin Count: 84
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Compliant

Contents
State Diagram .................................................................................................................................................. 9
Functional Description ................................................................................................................................... 10
Functional Block Diagrams ............................................................................................................................. 12
Ball Assignments and Descriptions ................................................................................................................. 15
Packaging ...................................................................................................................................................... 19
Electrical Specifications – Absolute Ratings ..................................................................................................... 23
Electrical Specifications – I
AC Timing Operating Specifications ................................................................................................................ 34
AC and DC Operating Conditions .................................................................................................................... 46
ODT DC Electrical Characteristics ................................................................................................................... 47
Input Electrical Characteristics and Operating Conditions ............................................................................... 48
Output Electrical Characteristics and Operating Conditions ............................................................................. 51
Output Driver Characteristics ......................................................................................................................... 53
Power and Ground Clamp Characteristics ....................................................................................................... 57
AC Overshoot/Undershoot Specification ......................................................................................................... 58
Input Slew Rate Derating ................................................................................................................................ 60
Commands .................................................................................................................................................... 73
Mode Register (MR) ........................................................................................................................................ 79
Extended Mode Register (EMR) ....................................................................................................................... 84
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. W 7/11 EN
Industrial Temperature ............................................................................................................................... 10
Automotive Temperature ............................................................................................................................ 11
General Notes ............................................................................................................................................ 11
Package Dimensions ................................................................................................................................... 19
FBGA Package Capacitance ......................................................................................................................... 22
Temperature and Thermal Impedance ........................................................................................................ 23
I
I
Truth Tables ............................................................................................................................................... 73
DESELECT ................................................................................................................................................. 77
NO OPERATION (NOP) ............................................................................................................................... 78
LOAD MODE (LM) ...................................................................................................................................... 78
ACTIVATE .................................................................................................................................................. 78
READ ......................................................................................................................................................... 78
WRITE ....................................................................................................................................................... 78
PRECHARGE .............................................................................................................................................. 79
REFRESH ................................................................................................................................................... 79
SELF REFRESH ........................................................................................................................................... 79
Burst Length .............................................................................................................................................. 80
Burst Type .................................................................................................................................................. 81
Operating Mode ......................................................................................................................................... 81
DLL RESET ................................................................................................................................................. 81
Write Recovery ........................................................................................................................................... 82
Power-Down Mode ..................................................................................................................................... 82
CAS Latency (CL) ........................................................................................................................................ 83
DLL Enable/Disable ................................................................................................................................... 85
Output Drive Strength ................................................................................................................................ 85
DQS# Enable/Disable ................................................................................................................................. 85
RDQS Enable/Disable ................................................................................................................................. 85
Output Enable/Disable ............................................................................................................................... 85
On-Die Termination (ODT) ......................................................................................................................... 86
DD
DD7
Specifications and Conditions ............................................................................................................... 26
Conditions .......................................................................................................................................... 27
DD
Parameters ........................................................................................................ 26
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
1Gb: x4, x8, x16 DDR2 SDRAM
‹ 2007 Micron Technology, Inc. All rights reserved.
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