MT47H64M16HR-3 IT:HTR Micron Technology Inc, MT47H64M16HR-3 IT:HTR Datasheet - Page 128
![no-image](/images/manufacturer_photos/0/4/441/micron_technology_inc_sml.jpg)
MT47H64M16HR-3 IT:HTR
Manufacturer Part Number
MT47H64M16HR-3 IT:HTR
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Specifications of MT47H64M16HR-3 IT:HTR
Organization
64Mx16
Density
1Gb
Address Bus
16b
Access Time (max)
450ps
Maximum Clock Rate
667MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
135mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / Rohs Status
Compliant
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Reset
CKE Low Anytime
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. W 7/11 EN
DDR2 SDRAM applications may go into a reset state anytime during normal operation.
If an application enters a reset condition, CKE is used to ensure the DDR2 SDRAM de-
vice resumes normal operation after reinitializing. All data will be lost during a reset
condition; however, the DDR2 SDRAM device will continue to operate properly if the
following conditions outlined in this section are satisfied.
The reset condition defined here assumes all supply voltages (V
V
eration. All other input balls of the DDR2 SDRAM device are a “Don’t Care” during RE-
SET with the exception of CKE.
If CKE asynchronously drops LOW during any valid operation (including a READ or
WRITE burst), the memory controller must satisfy the timing parameter
turning off the clocks. Stable clocks must exist at the CK, CK# inputs of the DRAM be-
fore CKE is raised HIGH, at which time the normal initialization sequence must occur
(see Initialization). The DDR2 SDRAM device is now ready for normal operation after
the initialization sequence. Figure 79 (page 129) shows the proper sequence for a RE-
SET operation.
REF
3. Minimum CKE high time is
4. If this command is a PRECHARGE (or if the device is already in the idle state), then the
) are stable and meet all DC specifications prior to, during, and after the RESET op-
This requires a minimum of three clock cycles of registration.
power-down mode shown is precharge power-down, which is required prior to the clock
frequency change.
128
t
CKE = 3 ×
Micron Technology, Inc. reserves the right to change products or specifications without notice.
t
CK. Minimum CKE LOW time is
1Gb: x4, x8, x16 DDR2 SDRAM
2007 Micron Technology, Inc. All rights reserved.
DD
, V
DDQ
t
CKE = 3 ×
t
, V
DELAY before
DDL
, and
Reset
t
CK.
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