AD7195BCPZ Analog Devices Inc, AD7195BCPZ Datasheet - Page 8
![IC AFE 24BIT 4.8K 32LFSP](/photos/18/97/189763/4243223_sml.jpg)
AD7195BCPZ
Manufacturer Part Number
AD7195BCPZ
Description
IC AFE 24BIT 4.8K 32LFSP
Manufacturer
Analog Devices Inc
Datasheet
1.AD7195BCPZ-RL.pdf
(44 pages)
Specifications of AD7195BCPZ
Design Resources
Precision Weigh Scale Design Using AD7195 with Internal PGA and AC Excitation (CN0155)
Number Of Bits
24
Number Of Channels
4
Voltage - Supply, Analog
4.75 V ~ 5.25 V
Voltage - Supply, Digital
2.7 V ~ 5.25 V
Package / Case
32-LFCSP
Resolution (bits)
24bit
Sampling Rate
4.8kSPS
Input Channel Type
Pseudo Differential
Data Interface
3-Wire, Serial
Supply Voltage Range - Analog
4.75V To 5.25V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power (watts)
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AD7195BCPZ
Manufacturer:
Analog Devices Inc
Quantity:
135
Company:
Part Number:
AD7195BCPZ
Manufacturer:
TST
Quantity:
5 000
Part Number:
AD7195BCPZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Company:
Part Number:
AD7195BCPZ-RL
Manufacturer:
SEMTECH
Quantity:
394
AD7195
ABSOLUTE MAXIMUM RATINGS
T
Table 3.
Parameter
AV
DV
AGND to DGND
Analog Input Voltage to AGND
Reference Input Voltage to AGND
Digital Input Voltage to DGND
Digital Output Voltage to DGND
AIN/Digital Input Current
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature
Lead Temperature, Soldering
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
A
Reflow
DD
DD
= 25°C, unless otherwise noted.
to AGND
to AGND
Rating
−0.3 V to +6.5 V
−0.3 V to +6.5 V
−0.3 V to +0.3 V
−0.3 V to AV
−0.3 V to AV
−0.3 V to DV
−0.3 V to DV
10 mA
−40°C to +105°C
−65°C to +150°C
150°C
260°C
DD
DD
DD
DD
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
Rev. 0 | Page 8 of 44
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
32-Lead LFCSP_WQ
ESD CAUTION
JA
is specified for the worst-case conditions, that is, a device
θ
32.5
JA
θ
32.71
JC
Unit
°C/W