ICS722M IDT, Integrated Device Technology Inc, ICS722M Datasheet - Page 3

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ICS722M

Manufacturer Part Number
ICS722M
Description
IC VCXO 3.3V 27MHZ 8-SOIC
Manufacturer
IDT, Integrated Device Technology Inc
Type
Voltage Controlled Crystal Oscillator (VCXO)r
Datasheet

Specifications of ICS722M

Package / Case
8-SOIC
Pll
No
Input
Crystal
Output
CMOS
Number Of Circuits
1
Ratio - Input:output
2:1
Differential - Input:output
No/No
Frequency - Max
28MHz
Divider/multiplier
No/No
Voltage - Supply
3.15 V ~ 3.45 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Frequency-max
28MHz
Output Level
CMOS
Frequency Stability
±30
Symmetry Max
60%
Operating Supply Voltage (typ)
3.3
Pin Count
8
Mounting Style
Surface Mount
Screening Level
Commercial
Frequency Tolerance
±20
Product Height (mm)
1.5mm
Product Depth (mm)
3.94mm
Product Length (mm)
4.93mm
Rad Hardened
No
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
722M

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ICS722MLF
Manufacturer:
ICS
Quantity:
20 000
External Component Selection
The ICS722 requires a minimum number of external
components for proper operation.
Decoupling Capacitors
A decoupling capacitor of 0.01µF should be connected
between VDD and GND on pins 2 and 4 as close to the
ICS722 as possible. For optimum device performance, the
decoupling capacitor should be mounted on the component
side of the PCB. Avoid the use of vias in the decoupling
circuit.
Series Termination Resistor
When the PCB trace between the clock output and the load
is over 1 inch, series termination should be used. To series
terminate a 50Ω trace (a commonly used trace impedance),
place a 33Ω resistor in series with the clock line, as close to
the clock output pin as possible. The nominal impedance of
the clock output is 20Ω .
Quartz Crystal
The ICS722 VCXO function consists of the external crystal
and the integrated VCXO oscillator circuit. To assure the
best system performance (frequency pull range) and
reliability, a crystal device with the recommended
parameters (shown below) must be used, and the layout
guidelines discussed in the following section shown must be
followed.
The oscillation frequency of a quartz crystal is determined
by its “cut” and by the load capacitors connected to it. The
ICS722 incorporates on-chip variable load capacitors that
“pull” (change) the frequency of the crystal. The crystal
specified for use with the ICS722 is designed to have zero
frequency error when the total of on-chip + stray
capacitance is
14 pF.
Recommended Crystal Parameters:
The external crystal must be connected as close to the chip
IDT™ / ICS™ LOW COST 27 MHZ 3.3 VOLT VCXO
ICS722
LOW COST 27 MHZ 3.3 VOLT VCXO
Initial Accuracy at 25
Temperature Stability
Aging
Load Capacitance
Shunt Capacitance, C0
C0/C1 Ratio
Equivalent Series Resistance
°
C
35 Ω Max
7 pF Max
±20 ppm
±30 ppm
±20 ppm
250 Max
14 pf
3
as possible and should be on the same side of the PCB as
the ICS722. There should be no via’s between the crystal
pins and the X1 and X2 device pins. There should be no
signal traces underneath or close to the crystal. See
application note MAN05.
Crystal Tuning Load Capacitors
The crystal traces should include pads for small fixed
capacitors, one between X1 and ground, and another
between X2 and ground. Stuffing of these capacitors on the
PCB is optional. The need for these capacitors is
determined at system prototype evaluation, and is
influenced by the particular crystal used (manufacture and
frequency) and by PCB layout. The typical required
capacitor value is 1 to 4 pF.
The procedure for determining the value of these capacitors
can be found in application note MAN05.
ICS722
REV B 110409
VCXO

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